GND

4

LMT87, LMT87-Q1

SNIS170D – JANUARY 2014 – REVISED JUNE 2017

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Product Folder Links: LMT87 LMT87-Q1

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Copyright © 2014–2017, Texas Instruments Incorporated

(1)

Direct connection to the back side of the die

Pin Functions

PIN

DESCRIPTION

NAME

SOT (SC70)

TO-92

TO-92S

TYPE

EQUIVALENT CIRCUIT

FUNCTION

GND

1

2

Ground

N/A

Power Supply Ground

OUT

3

2

1

Analog

Output

Outputs a voltage that is inversely

proportional to temperature

1, 4, 5

3

3

Power

N/A

Positive Supply Voltage

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Soldering process must comply with Reflow Temperature Profile specifications. Refer to www.ti.com/packaging.

(3)

7 Specifications

7.1 Absolute Maximum Ratings

See

(1) (2)

MIN

MAX

UNIT

Supply voltage

–0.3

6

V

Voltage at output pin

–0.3

V

Output current

–7

7

mA

–5

5

mA

150

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

The human body model is a 100-pF capacitor discharged through a 1.5-kΩ resistor into each pin.

(3)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings – LMT87

VALUE

UNIT

LMT87LP in TO-92 package

Electrostatic

discharge

±2500

V

±1000

LMT87DCK in SC70 package

Electrostatic

discharge

±2500

V

±1000

(1)

AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.

7.3 ESD Ratings – LMT87-Q1

VALUE

UNIT

LMT87DCK-Q1 in SC70 package

Electrostatic discharge

±2500

V

Charged-device model (CDM), per AEC Q100-011

±1000