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LOPL-E001M Datasheet(PDF) 7 Page - Lite-On Technology Corporation |
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LOPL-E001M Datasheet(HTML) 7 Page - Lite-On Technology Corporation |
7 / 12 page LITE-ON TECHNOLOGY CORPORATION Property of Lite-On Only Part No.: LOPL-E001M DATA SHEET Page: 7 of 12 BNC-OD-C131/A4 5. Reflow Soldering Characteristics Time tP Preheat, tS tL TSmin TSmax 25°C to Peak, TL Ramp-down Ramp-up TP ` Profile Feature Lead Free Assembly Average Ramp-Up Rate (TSmax to TP) 3°C / second max Preheat Temperature Min (TSmin) 150°C Preheat Temperature Max (TSmax) 200°C Preheat Time (tSmin to tSmax) 60 – 180 seconds Time Maintained Above Temperature (TL) 217°C Time Maintained Above Time (tL) 60 – 150 seconds Peak / Classification Temperature (TP) 260°C Time Within 5°C of Actual Peak Temperature (tP) 20 – 40 seconds Ramp – Down Rate 6°C / second max Time 25°C to Peak Temperature 8 minutes max Notes: All temperatures refer to topside of the package, measured on the package body surface. |
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