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SGP1575184C02 Datasheet(PDF) 11 Page - Taoglas antenna solutions |
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SGP1575184C02 Datasheet(HTML) 11 Page - Taoglas antenna solutions |
11 / 14 page SPE-11-8-138/F/SS Page 11 of 14 5. Recommended Reflow Soldering Profile SGP.18C can be assembled following Pb-free assembly. According to the Standard IPC/JEDEC J-STD-020C, the temperature profile suggested is as follow: Phase Profile Features Pb-Free Assembly (SnAgCu) PREHEAT Temperature Min(Tsmin) Temperature Max(Tsmax) Time(ts) from (Tsmin to Tsmax) 150°C 200°C 60-120 seconds RAMP-UP Avg. Ramp-up Rate (Tsmax to TP) 3°C/second(max) REFLOW Temperature(TL) Total Time above TL (tL) 217°C 30-100 seconds PEAK Temperature(TP) Time(tp) 260°C 2-5 seconds RAMP-DOWN Rate 3°C/second(max) Time from 25°C to Peak Temperature 8 minutes max. Composition of solder paste 96.5Sn/3Ag/0.5Cu Solder Paste Model SHENMAO PF606-P26 Soldering Iron condition: Soldering iron temperature 270°C±10°C. Apply preheating at 120°C for 2-3 minutes. Finish soldering for each terminal within 3 seconds, if soldering iron temperature over270°C±10°C or 3 seconds, it will make cause component surface peeling or damage. |
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