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6N134 Datasheet(PDF) 4 Page - Broadcom Corporation. |
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6N134 Datasheet(HTML) 4 Page - Broadcom Corporation. |
4 / 15 page Broadcom - 4 - 6N134, 81028, HCPL-563x, HCPL-663x, HCPL-565x, 5962-98001, HCPL-268K, HCPL-665x, 5962-90855, HCPL-560x Data Sheet Functional Diagrams Functional Diagrams NOTE All DIP and flat pack devices have common VCC and ground. Single channel DIP has an enable pin 7. LCCC (leadless ceramic chip carrier) package has isolated channels with separate VCC and ground connections. All diagrams are “top view.” Outline Drawings 16-Pin DIP, Through Hole, 2 Channels 16-Pin DIP 8-Pin DIP 8-Pin DIP 16-Pin Flat Pack 20-Pad LCCC Through Hole Through Hole Through Hole Unformed Leads Surface Mount 2 Channels 1 Channel 2 Channels 4 Channels 2 Channels 5 7 6 8 12 10 11 9 GND 1 3 2 4 16 14 15 13 VCC VO1 VO2 VCC VOUT VE GND 1 2 3 4 8 7 6 5 1 3 2 4 8 6 7 5 VCC GND VO2 VO1 5 7 6 8 12 10 11 9 GND 1 3 2 4 16 14 15 13 VCC VO1 VO3 VO2 VO4 GND 1 VO2 19 20 2 3 VO1 8 7 VCC2 VCC1 10 GND 2 15 13 12 0.20 (0.008) 0.33 (0.013) 4.45 (0.175) MAX. 20.06 (0.790) 20.83 (0.820) 0.51 (0.020) MAX. 2.29 (0.090) 2.79 (0.110) 0.51 (0.020) MIN. 0.89 (0.035) 1.65 (0.065) 8.13 (0.320) MAX. 7.36 (0.290) 7.87 (0.310) NOTE: DIMENSIONS IN MILLIMETERS (INCHES). 3.81 (0.150) MIN. |
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