12.7MHz, Dual Rail-to-Rail

Output Operational Amplifier

2

SGM8922

SG Micro Corp

www.sg-micro.com

PACKAGE/ORDERING INFORMATION

MODEL

PIN-

PACKAGE

SPECIFIED

TEMPERATURE

RANGE

ORDERING

NUMBER

PACKAGE

MARKING

PACKAGE

OPTION

MSOP-8

-40

℃ to +85℃

SGM8922YMS8/TR

SGM8922YMS8

Tape and Reel, 3000

SOIC-8

-40

℃ to +85℃

SGM8922YS8/TR

SGM8922YS8

Tape and Reel, 2500

TSSOP-8

-40

℃ to +85℃

SGM8922YTS8/TR

SGM8922YTS8

Tape and Reel, 4000

SGM8922

SOIC-8

-40

℃ to +125℃

SGM8922XS8/TR

SGM8922XS8

Tape and Reel, 2500

MSOP-8

-40

℃ to +85℃

SGM8922AYMS8/TR

SGM8922YMS8

Tape and Reel, 3000

SOIC-8

-40

℃ to +85℃

SGM8922AYS8/TR

SGM8922YS8

Tape and Reel, 2500

SGM8922A

SOIC-8

-40

℃ to +125℃

SGM8922AXS8/TR

SGM8922XS8

Tape and Reel, 2500

 

 

ABSOLUTE MAXIMUM RATINGS

Common Mode Input Voltage................................ -0.1V to 3.8V

Storage Temperature Range..............................-65

℃ to +150℃

Junction Temperature .......................................................150

℃

Operating Temperature Range..........................-40

℃ to +125℃

℃

℃/W

℃/W

℃/W

Lead Temperature (Soldering 10sec)

...........................................................................................260

℃

ESD Susceptibility

HBM..................................................................................8000V

MM......................................................................................400V

NOTE:

Stresses beyond those listed under “Absolute Maximum

Ratings” may cause permanent damage to the device. These

are stress ratings only, and functional operation of the device at

these or any other conditions beyond those indicated in the

operational sections of the specifications is not implied.

Exposure to absolute maximum rating conditions for extended

periods may affect device reliability.

CAUTION

This integrated circuit can be damaged by ESD if you don’t pay

attention to ESD protection. SGMICRO recommends that all

integrated circuits be handled with appropriate precautions.

Failure to observe proper handling and installation procedures

can cause damage. ESD damage can range from subtle

performance degradation to complete device failure. Precision

integrated circuits may be more susceptible to damage because

very small parametric changes could cause the device not to

meet its published specifications.

SGMICRO reserves the right to make any change in circuit

design, specification or other related things if necessary without

notice at any time. Please contact SGMICRO sales office to get

the latest datasheet.

+IN2

5

6

7

8

1

2

3

4

-IN1

+IN1

-IN2

SOIC-8/MSOP-8/TSSOP-8