R10DS0256EJ0101 Rev. 1.01

Page 9 of 53

Jan. 15, 2016

Contents

1.

Electrical Characteristics....................................................................................................10

2. Operation ...............................................................................................................................17

2.1

Command Operation ................................................................................................17

2.2

Description of Commands .......................................................................................17

2.3

Initialization ...............................................................................................................18

2.4

Power-On Sequence.................................................................................................19

2.5

Programmable Impedance Output Buffer...............................................................19

2.6

PLL Reset ..................................................................................................................19

2.7

Clock Input ................................................................................................................19

2.8

Mode Register Set Command (MRS).......................................................................21

2.9

Read & Write configuration (Non Multiplexed Address Mode) .............................22

2.10 Write Operation (WRITE) ..........................................................................................23

2.11 Read Operation (READ) ...........................................................................................26

2.12 Refresh Operation: AUTO REFRESH Command (AREF) ......................................30

2.13 On-Die Termination ..................................................................................................31

2.14 Operation with Multiplexed Address.......................................................................34

2.15 Address Mapping in Multiplexed Mode ..................................................................36

2.16 Read & Write configuration in Multiplexed Address Mode ...................................37

2.17 Refresh Command in Multiplexed Address Mode .................................................37

2.18 Input Slew Rate Derating .........................................................................................39

3. JTAG Specification ...............................................................................................................43

4. Package Dimension ..............................................................................................................50

5. Recommended Soldering Condition ...................................................................................50