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HT7991 Datasheet(PDF) 10 Page - Holtek Semiconductor Inc |
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HT7991 Datasheet(HTML) 10 Page - Holtek Semiconductor Inc |
10 / 13 page Rev. 1.20 10 June 01, 2017 HT7991 Thermal Considerations Forcontinuousoperation,donotexceedtheabsolute maximum junction temperature.The maximum powerdissipationdependsonthethermalresistance oftheICpackage,PCBlayout,rateofsurrounding airflow,andthealloweddifferencebetweenthe junctionandambienttemperatures.Themaximum powerdissipationcanbecalculatedbythefollowing formula: PD(MAX)=(TJ(MAX)–TA)/θJA(W) WhereTJ(MAX)isthemaximumjunctiontemperature, TAistheambienttemperature,andθJAisthejunction toambientthermalresistance. Therecommendedoperatingconditionsspecifyamax- max- max- imumjunctiontemperatureis125°C.Thejunctionto ambientthermalresistance,θJA,islayoutdependent.On astandardJEDEC51-7four-layerthermaltestboard, thethermalresistance,θJA,oftheQFN-10packageis 50°C/W.ThemaximumpowerdissipationatTA=25°C canbecalculatedbythefollowingformula. PD(MAX)=(125oC–25oC)/(220oC/W)=455mW ForafixedTJ(MAX)of125oC,themaximumpowerdis- dis- dis- sipationdependsontheoperatingambienttemperature andthepackage'sthermalresistance,θJA.Thede-rating curvebelowshowstheeffectofrisingambienttemperature onthemaximumrecommendedpowerdissipation. Ambient Temperature (oC) 25 0 50 75 100 125 0.0 125 250 375 500 625 Four-Layer PCB 85 Layout Consideration Guide Suggested Layout Toreduceproblemswithconductednoise,PCBlayoutisveryimportanttostability.Thelayoutrecommendations arelistedbelow: (1)TheinputbypasscapacitormustbeplacedclosetotheVINpin. (2)Theinductor,schottkydiode,andoutputcapacitortraceshouldbeasshortaspossibletoreduceconductedand radiatednoiseandincreaseoverallefficiency. (3)Keepthepowergroundandsupplypathsasshortandwideaspossible. |
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