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PCM1865-Q1 Datasheet(PDF) 11 Page - Texas Instruments |
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PCM1865-Q1 Datasheet(HTML) 11 Page - Texas Instruments |
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11 / 141 page  11 PCM1860-Q1, PCM1861-Q1, PCM1862-Q1 PCM1863-Q1, PCM1864-Q1, PCM1865-Q1 www.ti.com SLASE64A – DECEMBER 2014 – REVISED JUNE 2017 Product Folder Links: PCM1860-Q1 PCM1861-Q1 PCM1862-Q1 PCM1863-Q1 PCM1864-Q1 PCM1865-Q1 Submit Documentation Feedback Copyright © 2014–2017, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7 Specifications 7.1 Absolute Maximum Ratings over operating temperature (unless otherwise noted) (1) MIN MAX UNIT Supply voltage AVDD to AGND –0.3 3.9 V DVDD to DGND –0.3 3.9 IOVDD to DGND –0.3 3.9 Ground voltage differences AGND to DGND –0.3 0.3 V Digital input voltage Digital input to DGND –0.3 IOVDD + 0.3 V XI to DGND –0.3 2.1 Analog input voltage VINxx to AGND –1.7 5.0 V Temperature Operating ambient, TA –40 125 °C Junction, TJ –40 150 Storage, Tstg –40 150 (1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per AEC Q100-002(1) ±2000 V Charged-device model (CDM), per AEC Q100-011 ±750 7.3 Recommended Operating Conditions MIN NOM MAX UNIT POWER AVDD Analog supply voltage to AGND 3.0 3.3 3.6 V DVDD Digital supply voltage to DGND 3.0 3.3 3.6 V IOVDD IO supply voltage to DGND at 1.8 V 1.62 1.8 1.98 V at 3.3 V 3.0 3.3 3.6 V LDO LDO pin voltage to DGND (LDO is an input when using external 1.8-V power supply) IOVDD – 0.3 IOVDD IOVDD + 0.3 V TEMPERATURE TA Operating ambient temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information THERMAL METRIC(1) PCM186x-Q1 UNIT DBT (TSSOP) 30 PINS RθJA Junction-to-ambient thermal resistance 79.6 °C/W RθJC(top) Junction-to-case (top) thermal resistance 15.1 °C/W RθJB Junction-to-board thermal resistance 33.1 °C/W ψJT Junction-to-top characterization parameter 0.4 °C/W ψJB Junction-to-board characterization parameter 32.6 °C/W |
Similar Part No. - PCM1865-Q1 |
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Similar Description - PCM1865-Q1 |
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