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OPA2187IDR Datasheet(PDF) 5 Page - Texas Instruments |
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OPA2187IDR Datasheet(HTML) 5 Page - Texas Instruments |
5 / 35 page 5 OPA187, OPA2187, OPA4187 www.ti.com SBOS807 – DECEMBER 2016 Product Folder Links: OPA187 OPA2187 OPA4187 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.5 V beyond the supply rails should be current limited to ±10 mA or less. (3) Refer to the Electrical Overstress section for more information. (4) Output terminals are diode-clamped to the power-supply rails. Output signals that can swing more than 0.5 V beyond the supply rails should be current limited to ±55 mA or less. (5) Short-circuit to ground, one amplifier per package. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT Voltage Supply, VS = (V +) – (V–) 40 V Signal input pin(2) Common-mode (V–) – 0.5 (V+) + 0.5 Differential(3) ±0.5 Signal output pin(4) (V–) – 0.5 (V+) + 0.5 Current Signal input pin(2) –10 10 mA Signal output pin(4) –55 55 mA Output short-circuit(5) Continuous Continuous Continuous Temperature Operating, TA –55 150 °C Junction, TJ 150 Storage, Tstg –65 150 (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V Charged-device model (CDM), per JEDEC specification JESD22- C101(2) ±1500 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT (V+) – (V–) Supply voltage 4.5 (±2.25) 36 (±18) V TA Specified temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information: OPAx187 THERMAL METRIC(1) OPAx187 UNIT 8 PINS DGK (VSSOP) RθJA Junction-to-ambient thermal resistance 159 °C/W RθJC(top) Junction-to-case (top) thermal resistance 37 °C/W RθJB Junction-to-board thermal resistance 49 °C/W ψJT Junction-to-top characterization parameter 1.2 °C/W ψJB Junction-to-board characterization parameter 77.1 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W |
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