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LMX2595 Datasheet(PDF) 4 Page - Texas Instruments |
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LMX2595 Datasheet(HTML) 4 Page - Texas Instruments |
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4 / 70 page  4 LMX2595 SNAS736 – JUNE 2017 www.ti.com Product Folder Links: LMX2595 Submit Documentation Feedback Copyright © 2017, Texas Instruments Incorporated Pin Functions PIN I/O DESCRIPTION NO. NAME 1 CE Input Chip enable input. Active HIGH powers on the device. 2, 4, 25, 31, 34, 39, 40 GND Ground VCO ground 3 VbiasVCO Bypass VCO bias. Requires connecting 10-µF capacitor to VCO ground. Place close to pin. 5 SYNC Input Phase synchronization pin. Has programmable threshold. 6, 14 GND Ground Digital ground 7 VccDIG Supply Digital supply. TI recommends bypassing with a 0.1-µF capacitor to digital ground. 8 OSCinP Input Reference input clock (+). High-impedance self-biasing pin. Requires AC coupling capacitor. (0.1 µF recommended) 9 OSCinM Input Reference input clock (–). High impedance self-biasing pin. Requires AC coupling capacitor. (0.1 µF recommended) 10 VregIN Bypass Input reference path regulator output. Requires connecting 1 µF capacitor to ground. Place close to pin. 11 VccCP Supply Charge pump supply.TI recommends bypassing with a 0.1-µF capacitor to charge pump ground. 12 CPout Output Charge pump output. TI recommends connecting C1 of loop filter close to pin. 13 GND Ground Charge pump ground 15 VccMASH Supply Digital supply. TI recommends bypassing with a 0.1-µF and 10-µF capacitor to digital ground. 16 SCK Input SPI clock. High impedance CMOS input. 1.8-V to 3.3-V logic. 17 SDI Input SPI data. High impedance CMOS input. 1.8-V to 3.3-V logic. 18 RFoutBM Output Differential output B (–). Requires pullup (typically 50-Ω resistor) to VCC as close as possible to pin. Can be used as an output signal or SYSREF output. 19 RFoutBP Output Differential output B (+). Requires pullup (typically 50-Ω resistor) to VCC as close as possible to pin. Can be used as an output signal or SYSREF output. 20 MUXout Output Multiplexed output pin — lock detect, readback, diagnostics, ramp status 21 VccBUF Supply Output buffer supply. TI recommends bypassing with a 0.1-µF capacitor to RFout ground. 22 RFoutAM Output Differential output A (–). Requires connecting 50-Ω resistor pullup to Vcc as close as possible to pin. 23 RFoutAP Output Differential output A (+). Requires connecting 50-Ω resistor pullup to Vcc as close as possible to pin. 24 CSB Input SPI latch. Chip Select Bar . High-impedance CMOS input. 1.8-V to 3.3-V logic. 26 VccVCO2 Supply VCO supply. TI recommends bypassing with a 0.1-µF and 10-µF capacitor to VCO ground. 27 VbiasVCO2 Bypass VCO bias. Requires connecting 1-µF capacitor to VCO ground. 28 SysRefReq Input SYSREF request input for JESD204B support 29 VrefVCO2 Bypass VCO supply reference. Requires connecting 10-µF capacitor to VCO ground. 30 RampClk Input Input pin for ramping mode that can be used to clock the ramp in manual ramping mode or as a trigger input. 32 RampDir Input Input pin for ramping mode that can be used to change ramp direction in manual ramping mode or as a trigger input. 33 VbiasVARAC Bypass VCO Varactor bias. Requires connecting 10-µF capacitor to VCO ground. 35 Vtune Input VCO tuning voltage input 36 VrefVCO Bypass VCO supply reference. Requires connecting 10-µF capacitor to ground. 37 VccVCO Supply VCO supply. Recommend bypassing with 0.1-µF and 10-µF capacitor to ground. 38 VregVCO Bypass VCO regulator node. Requires connecting 1-µF capacitor to ground. DAP GND Ground Die Attached Pad. Used for RFout ground. |
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