5

bq27750

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SLUSCM7 – JUNE 2017

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

bq27750

UNIT

VSON (DRZ)

12 PINS

Junction-to-ambient thermal resistance

186.4

°C/W

Junction-to-case(top) thermal resistance

90.4

Junction-to-board thermal resistance

110.7

Junction-to-top characterization parameter

96.7

Junction-to-board characterization parameter

90

Junction-to-case(bottom) thermal resistance

n/a

(1)

Dependent on the use of the correct firmware (FW) configuration

6.5 Supply Current

PARAMETER

TEST CONDITION

MIN

TYP

MAX

UNIT

(1)

NORMAL mode

CHG = ON, DSG = ON, No Flash Write

250

µA

(1)

SLEEP mode

CHG = OFF, DSG = OFF, No Communication on

Bus

100

SHUTDOWN mode

0.5

2

µA

6.6 Power Supply Control

PARAMETER

TEST CONDITION

MIN

TYP

MAX

UNIT

BAT to PACK

switchover voltage

2.0

2.1

2.2

V

PACK to BAT

switchover voltage

3.0

3.1

3.2

V

Switchover voltage

hysteresis

1000

mV

Input Leakage

current

BAT pin, BAT = 0 V, PACK = 25 V

1

µA

PACK pin, BAT = 25 V, PACK = 0 V

1

BAT and PACK pins, BAT = 0 V, PACK = 0 V,

PBI = 25 V

1

Internal pulldown

resistance

PACK

30

40

50

kΩ

6.7 Low-Voltage General Purpose I/O, TS1

PARAMETER

TEST CONDITION

MIN

TYP

MAX

UNIT

High-level input

V

Low-level input

V

Output voltage high

V

Output voltage low

V

Input capacitance

5

pF

Input leakage

current

1

µA