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R1EV5801MB Datasheet(PDF) 6 Page - Renesas Technology Corp

Part # R1EV5801MB
Description  1M EEPROM (128-Kword8-bit)Ready Busy and RES function
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Manufacturer  RENESAS [Renesas Technology Corp]
Direct Link  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

R1EV5801MB Datasheet(HTML) 6 Page - Renesas Technology Corp

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R1EV5801MB Series
R10DS0209EJ0200 Rev.2.00
Page 6 of 20
May 12, 2016
AC Characteristics
(Ta = -40 to +85
C, VCC = 2.7 V to 5.5 V)
Test Conditions
 Input pulse levels:
0.4 V to 2.4 V,
0 V to VCC (RES pin)
 Input rise and fall time:  20 ns
 Output load: 1TTL Gate +100 pF
 Reference levels for measuring timing: 0.8 V, 2.0 V
Read Cycle
Parameter
Symbol
Min
Max
Unit
Test conditions
Address to output delay
tACC
250
ns
CE = OE = VIL, WE = VIH
CE to output delay
tCE
250
ns
OE = VIL, WE = VIH
OE to output delay
tOE
10
120
ns
CE = VIL, WE = VIH
Address to output hold
tOH
0
ns
CE = OE = VIL, WE = VIH
OE (CE) high to output float*1
tDF
0
50
ns
CE = VIL, WE = VIH
RES low to output float*1
tDFR
0
350
ns
CE = OE = VIL, WE = VIH
RES to output delay
tRR
0
600
ns
CE = OE = VIL, WE = VIH
Write Cycle
Parameter
Symbol
Min*
2
Typ
Max
Unit
Test conditions
Address setup time
tAS
0
ns
Address hold time
tAH
150
ns
CE to write setup time (WE controlled)
tCS
0
ns
CE hold time (WE controlled)
tCH
0
ns
WE to write setup time (CE controlled)
tWS
0
ns
WE hold time (CE controlled)
tWH
0
ns
OE to write setup time
tOES
0
ns
OE hold time
tOEH
0
ns
Data setup time
tDS
100
ns
Data hold time
tDH
10
ns
WE pulse width (WE controlled)
tWP
0.250
30
µs
CE pulse width (CE controlled)
tCW
0.250
30
µs
Data latch time
tDL
750
ns
Byte load cycle
tBLC
1.0
30
s
Byte load window
tBL
100
s
Write cycle time
tWC
10*
3
ms
Time to device busy
tDB
120
ns
Write start time
tDW
250*
4
ns
Reset protect time
tRP
100
s
Reset high time*
5
tRES
1
s
Notes: 1. tDF and tDFR are defined as the time at which the outputs achieve the open circuit conditions and are no longer
driven.
2. Use this device in longer cycle than this value.
3. tWC must be longer than this value unless polling techniques or RDY/Busy are used. This device automatically
completes the internal write operation within this value.
4. Next read or write operation can be initiated after tDW if polling techniques or RDY/Busy are used.
5. This parameter is sampled and not 100
 tested.
6. A7 through A16 are page addresses and these addresses are latched at the first falling edge of
WE.
7. A7 through A16 are page addresses and these addresses are latched at the first falling edge of
CE.
8. See AC read characteristics.


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