DATA SHEET • SKY66113-11: BLUETOOTH LOW ENERGY/802.15.4/THREAD/ZIGBEE FEM

Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100 • sales@skyworksinc.com • www.skyworksinc.com

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May 10, 2017 • Skyworks Proprietary Information • Products and Product Information are Subject to Change Without Notice • 203670F

Table 7. SKY66113-11 Evaluation Board Bill of Materials (BOM)

Component

Value

Manufacturer

Mfr Part Number

Package

Description

C2, C9

13 pF

Murata

GRM1555C1H130JA01D

0402

Ceramic capacitor, 13 pF, 5%, C0G, 50 V, 0402

C3

1 nF

Various

Various

0402

Ceramic capacitor, 1000 pF, 10%, X7R, 50 V, 0402

C8

0.1 uF

Various

Various

0402

Ceramic capacitor, 0.1 uF, 10%, X7R, 16 V, 0402

C10, C12

10 pF

Various

Various

0402

Ceramic capacitor, 10 pF, 2%, C0G, 50 V, 0402

C14

4.7 uF

Various

Various

0402

Ceramic capacitor, 4.7 uF, 20%, X5R, 10 V, 0402

R6 R4

1 k

Ω

Various

Various

0402

Resistor, 1000 ohm, 5%, 0.063 W, 0402

J1 J2

Johnson Components

142-0701-851

End launch

SMA end launch straight jack receptacle

J3

Samtec

TSW-112-07-G-D

100 mil

100 mil header

2.7 mm

Pin 16

Stencil aperture size for

center ground pad should be 80% to 100%

(by area) of the solder mask opening

Metallization

Solder Mask Opening

Stencil Aperture

Notes:

1. All dimensions are in millimeters, unless otherwise specified.

2. Thermal vias should be resin filled and capped in accordance with IPC-4761Type VII vias.

Recommended Cu thickness is 30 to 35 µm.

Thermal via array

improves thermal performance

Package Outline

10X 0.45 mm

12X 0.2 mm

Pin 1

Pin 1 Indicator

0.20 x 45°

Pitch 0.5 mm

1 mm

2.8 mm

Opening size of 60% to 100%

of the exposed center opening shown

Package Outline

2.8 mm

Pitch 0.5 mm

Pin 16

203670-006

Pin 1

2.7 mm

10X 0.45 mm

1 mm

2.7 mm

5X 0.45 mm

11X 0.2 mm

2.7 mm

6X 0.45 mm

Pitch 0.6 mm

Package Outline

Pitch 0.5 mm

10X 0.55 mm

10X 0.55 mm

Pin 16

Pin 1

12X 0.3 mm

Pin 1 Indicator

0.20 x 45°

2X 0.5 mm

2X 0.5 mm

0.25 mm Typ

Pitch 0.6 mm

Figure 6. SKY66113-11 PCB Layout Footprint