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C0603C154MHRACAUTO Datasheet(PDF) 11 Page - Kemet Corporation |
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C0603C154MHRACAUTO Datasheet(HTML) 11 Page - Kemet Corporation |
11 / 21 page © KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1076_X7R_HV_AUTO_SMD • 11/21/2016 11 Surface Mount Multilayer Ceramic Chip Capacitors, (SMD MLCCs) High Voltage X7R Dielectric, 500 – 3,000 VDC (Automotive Grade) Soldering Process Recommended Soldering Technique: • Solder wave or solder reflow for EIA case sizes 0603, 0805 and 1206 • All other EIA case sizes are limited to solder reflow only Recommended Reflow Soldering Profile: KEMET’s families of surface mount multilayer ceramic capacitors (SMD MLCCs) are compatible with wave (single or dual), convection, IR or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET’s recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J- STD-020 standard for moisture sensitivity testing. These devices can safely withstand a maximum of three reflow passes at these conditions. Storage and Handling Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature–reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of receipt. Profile Feature Termination Finish SnPb 100% Matte Sn Preheat/Soak Temperature Minimum (T Smin) 100°C 150°C Temperature Maximum (T Smax) 150°C 200°C Time (t S) from TSmin to TSmax 60 – 120 seconds 60 – 120 seconds Ramp-Up Rate (T L to TP) 3°C/second maximum 3°C/second maximum Liquidous Temperature (T L) 183°C 217°C Time Above Liquidous (t L) 60 – 150 seconds 60 – 150 seconds Peak Temperature (T P) 235°C 260°C Time Within 5°C of Maximum Peak Temperature (t P) 20 seconds maximum 30 seconds maximum Ramp-Down Rate (T P to TL) 6°C/second maximum 6°C/second maximum Time 25°C to Peak Temperature 6 minutes maximum 8 minutes maximum Note 1: All temperatures refer to the center of the package, measured on the capacitor body surface that is facing up during assembly reflow. Time T smin 25 T smax T L T P Maximum Ramp Up Rate = 3ºC/sec Maximum Ramp Down Rate = 6ºC/sec t P t L t s 25ºC to Peak |
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