ESD7371, SZESD7371 Series

http://onsemi.com

6

PACKAGE DIMENSIONS

SOD−323

CASE 477−02

ISSUE H

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. LEAD THICKNESS SPECIFIED PER L/F DRAWING

WITH SOLDER PLATING.

4. DIMENSIONS A AND B DO NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS.

5. DIMENSION L IS MEASURED FROM END OF RADIUS.

NOTE 3

D

1

2

b

E

A3

A1

A

C

NOTE 5

L

DIM

MIN

NOM

MAX

MILLIMETERS

A

0.80

0.90

1.00

A1

0.00

0.05

0.10

A3

0.15 REF

b

0.25

0.32

0.4

C

0.089

0.12

0.177

D

1.60

1.70

1.80

E

1.15

1.25

1.35

0.08

2.30

2.50

2.70

L

0.031

0.035

0.040

0.000

0.002

0.004

0.006 REF

0.010

0.012

0.016

0.003

0.005

0.007

0.062

0.066

0.070

0.045

0.049

0.053

0.003

0.090

0.098

0.105

MIN

NOM

MAX

INCHES

1.60

0.063

0.63

0.025

0.83

0.033

2.85

0.112

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*