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NAND256R3A2CN6 Datasheet(PDF) 7 Page - STMicroelectronics

Part # NAND256R3A2CN6
Description  128 Mbit, 256 Mbit, 512 Mbit, 1 Gbit (x8/x16) 528 Byte/264 Word Page, 1.8V/3V, NAND Flash Memories
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Manufacturer  STMICROELECTRONICS [STMicroelectronics]
Direct Link  http://www.st.com
Logo STMICROELECTRONICS - STMicroelectronics

NAND256R3A2CN6 Datasheet(HTML) 7 Page - STMicroelectronics

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NAND128-A, NAND256-A, NAND512-A, NAND01G-A
SUMMARY DESCRIPTION
The NAND Flash 528 Byte/ 264 Word Page is a
family of non-volatile Flash memories that uses
the Single Level Cell (SLC) NAND cell technology.
It is referred to as the Small Page family. The de-
vices range from 128Mbits to 1Gbit and operate
with either a 1.8V or 3V voltage supply. The size of
a Page is either 528 Bytes (512 + 16 spare) or 264
Words (256 + 8 spare) depending on whether the
device has a x8 or x16 bus width.
The address lines are multiplexed with the Data In-
put/Output signals on a multiplexed x8 or x16 In-
put/Output bus. This interface reduces the pin
count and makes it possible to migrate to other
densities without changing the footprint.
Each block can be programmed and erased over
100,000 cycles. To extend the lifetime of NAND
Flash devices it is strongly recommended to imple-
ment an Error Correction Code (ECC). A Write
Protect pin is available to give a hardware protec-
tion against program and erase operations.
The devices feature an open-drain Ready/Busy
output that can be used to identify if the Program/
Erase/Read (P/E/R) Controller is currently active.
The use of an open-drain output allows the Ready/
Busy pins from several memories to be connected
to a single pull-up resistor.
A Copy Back command is available to optimize the
management of defective blocks. When a Page
Program operation fails, the data can be pro-
grammed in another page without having to re-
send the data to be programmed.
The devices are available in the following packag-
es:
TSOP48 12 x 20mm for all products
USOP48 12 x 17 x 0.65mm for 128Mb, 256Mb
and 512Mb products
VFBGA55 (8 x 10 x 1mm, 6 x 8 ball array,
0.8mm pitch) for 128Mb and 256Mb products
TFBGA55 (8 x 10 x 1.2mm, 6 x 8 ball array,
0.8mm pitch) for 512Mb Dual Die product
VFBGA63 (9 x 11 x 1mm, 6 x 8 ball array,
0.8mm pitch) for the 512Mb product
TFBGA63 (9 x 11 x 1.2mm, 6 x 8 ball array,
0.8mm pitch) for the 1Gb Dual Die product
Two options are available for the NAND Flash
family:
Chip Enable Don’t Care, which allows code to be
directly downloaded by a microcontroller, as Chip
Enable transitions during the latency time do not
stop the read operation.
A Serial Number, which allows each device to be
uniquely identified. The Serial Number options is
subject to an NDA (Non Disclosure Agreement)
and so not described in the datasheet. For more
details of this option contact your nearest ST Sales
office.
For information on how to order these options refer
to Table 28., Ordering Information Scheme. De-
vices are shipped from the factory with Block 0 al-
ways valid and the memory content bits, in valid
blocks, erased to ’1’.
See Table 2., Product Description, for all the de-
vices available in the family.


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