LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

Page 8/15

Recommended Profile for Reflow Soldering

Pb -free solder temperature profile

120 Sec. Max.

60 Sec.Max.

Above220°C

1-5°C/Sec.

1-5°C/Sec.

6°C/Sec.

260°C.Max.

10 Sec .Max.

Pre-heating

180-200°C

180-200°C

10 Sec Max

260°C Max

120 Sec Max

Pb -free solder Temperature profile

Pre-heat

Pre-heat time

Peak-Temperature

Soldering time condition

(1) Reflow soldering should not be done more than two times.

(2) When soldering,do not put stress on the LEDs during heating.

(3) After soldering,do not warp the circuit board.

(4) The encapsulated material of the LEDs is silicone.

Precautions should be taken to avoid the strong pressure on the encapsulated part.

So when using the chip mounter,the picking up nozzle that does not affect the

silicone resin should be used.

Hand Soldering Conditions:

Do not exceed 3 seconds at maximum 320°C under soldering iron.(one time only)