© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com

F3070_PME261 • 9/23/2016

6

Film Capacitors – General Purpose, Pulse and DC Transient Suppression

PME261 Series Metallized Impregnated Paper, 10.2 – 25.4 mm Lead Spacing, 400 – 1,000 VDC

Manual Soldering Recommendations

Following is the recommendation for manual

soldering with a soldering iron.

The soldering iron tip temperature should

besetat350°C(+10°Cmaximum)withthe

soldering duration not to exceed more than 3

seconds.

Recommended Soldering Temperature

0

50

100

150

200

250

300

350

400

0

1

2

3

4

5

6

7

8

Soldering time (sec)

Soldering Process

The implementation of the RoHS directive has resulted in the selection of SnAgCu (SAC) alloys or SnCu alloys as primary solder.

This has increased the liquidus temperature from that of 183ºC for SnPb eutectic alloy to 217 – 221ºC for the new alloys. As a

result, the heat stress to the components, even in wave soldering, has increased considerably due to higher pre-heat and wave

temperatures. Polypropylene capacitors are especially sensitive to heat (the melting point of polypropylene is 160 – 170ºC). Wave

soldering can be destructive, especially for mechanically small polypropylene capacitors (with lead spacing of 5 mm to 15 mm),

andgreatcarehastobetakenduringsoldering.TherecommendedsolderprofilesfromKEMETshouldbeused.Pleaseconsult

KEMET with any questions. In general, the wave soldering curve from IEC Publication 61760-1 Edition 2 serves as a solid guideline

for successful soldering. Please see Figure 1.

Reflowsolderingisnotrecommendedforthrough-holefilmcapacitors.Exposingcapacitorstoasolderingprofileinexcessofthe

above the recommended limits may result to degradation or permanent damage to the capacitors.

Do not place the polypropylene capacitor through an adhesive curing oven to cure resin for surface mount components. Insert

through-holepartsafterthecuringofsurfacemountparts.ConsultKEMETtodiscusstheactualtemperatureprofileintheoven,

if through-hole components must pass through the adhesive curing process. A maximum two soldering cycles is recommended.

Please allow time for the capacitor surface temperature to return to a normal temperature before the second soldering cycle.

Wave Soldering Recommendations

0

50

100

150

200

250

300

0

40

80

120

160

200

240

Time (s)

ca 2°C/s

ca 3.5°C/s typical

ca 5°C/s

Cooling

2+3s max

115°C max

ΔT <150°C

100°C

Preheating

Typical

First wave

Second wave

260°C