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ESD7481 Datasheet(PDF) 1 Page - ON Semiconductor |
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ESD7481 Datasheet(HTML) 1 Page - ON Semiconductor |
1 / 5 page © Semiconductor Components Industries, LLC, 2016 March, 2016 − Rev. 8 1 Publication Order Number: ESD7481/D ESD7481, SZESD7481 ESD Protection Diodes Micro−Packaged Diodes for ESD Protection The ESD7481 is designed to protect voltage sensitive components that require ultra−low capacitance from ESD and transient voltage events. Excellent clamping capability, low capacitance, low leakage, and fast response time, make these parts ideal for ESD protection on designs where board space is at a premium. Because of its low capacitance, the part is well suited for use in high frequency designs such as USB 2.0 high speed and antenna line applications. Features • Ultra−Low Capacitance 0.25 pF • Low Clamping Voltage • Small Body Outline Dimensions: 0.60 mm x 0.30 mm • Low Body Height: 0.3 mm • Stand−off Voltage: 3.3 V • Low Leakage • Insertion Loss: 0.030 dBm • Response Time is < 1 ns • Low Dynamic Resistance < 1 W • IEC61000−4−2 Level 4 ESD Protection • SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable • These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS Compliant Typical Applications • RF Signal ESD Protection • RF Switching, PA, and Antenna ESD Protection • Near Field Communications MAXIMUM RATINGS Rating Symbol Value Unit IEC 61000−4−2 (ESD) Contact Air ±20 ±20 kV Total Power Dissipation on FR−5 Board (Note 1) @ TA = 25°C Thermal Resistance, Junction−to−Ambient °PD° RqJA 250 400 mW °C/W Junction and Storage Temperature Range TJ, Tstg −40 to +125 °C Lead Solder Temperature − Maximum (10 Second Duration) TL 260 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−5 = 1.0 x 0.75 x 0.62 in. See Application Note AND8308/D for further description of survivability specs. Device Package Shipping† ORDERING INFORMATION www.onsemi.com †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ESD7481MUT5G X3DFN2 (Pb−Free) 10000 / Tape & Reel X3DFN2 CASE 152AF MARKING DIAGRAM PIN 1 F = Specific Device Code M = Date Code 1 Cathode 2 Anode F M SZESD7481MUT5G X3DFN2 (Pb−Free) 15000 / Tape & Reel |
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