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ESD7481 Datasheet(PDF) 1 Page - ON Semiconductor

Part # ESD7481
Description  ESD Protection Diodes
Download  5 Pages
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Manufacturer  ONSEMI [ON Semiconductor]
Direct Link  http://www.onsemi.com
Logo ONSEMI - ON Semiconductor

ESD7481 Datasheet(HTML) 1 Page - ON Semiconductor

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© Semiconductor Components Industries, LLC, 2016
March, 2016 − Rev. 8
1
Publication Order Number:
ESD7481/D
ESD7481, SZESD7481
ESD Protection Diodes
Micro−Packaged Diodes for ESD Protection
The ESD7481 is designed to protect voltage sensitive components
that require ultra−low capacitance from ESD and transient voltage
events. Excellent clamping capability, low capacitance, low leakage,
and fast response time, make these parts ideal for ESD protection on
designs where board space is at a premium. Because of its low
capacitance, the part is well suited for use in high frequency designs
such as USB 2.0 high speed and antenna line applications.
Features
Ultra−Low Capacitance 0.25 pF
Low Clamping Voltage
Small Body Outline Dimensions: 0.60 mm x 0.30 mm
Low Body Height: 0.3 mm
Stand−off Voltage: 3.3 V
Low Leakage
Insertion Loss: 0.030 dBm
Response Time is < 1 ns
Low Dynamic Resistance < 1 W
IEC61000−4−2 Level 4 ESD Protection
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Typical Applications
RF Signal ESD Protection
RF Switching, PA, and Antenna ESD Protection
Near Field Communications
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
IEC 61000−4−2 (ESD)
Contact
Air
±20
±20
kV
Total Power Dissipation on FR−5 Board
(Note 1) @ TA = 25°C
Thermal Resistance, Junction−to−Ambient
°PD°
RqJA
250
400
mW
°C/W
Junction and Storage Temperature Range
TJ, Tstg
−40 to +125
°C
Lead Solder Temperature − Maximum
(10 Second Duration)
TL
260
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
Device
Package
Shipping
ORDERING INFORMATION
www.onsemi.com
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
ESD7481MUT5G
X3DFN2
(Pb−Free)
10000 / Tape &
Reel
X3DFN2
CASE 152AF
MARKING
DIAGRAM
PIN 1
F
= Specific Device Code
M
= Date Code
1
Cathode
2
Anode
F M
SZESD7481MUT5G
X3DFN2
(Pb−Free)
15000 / Tape &
Reel


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