ESD8101, ESD8111

www.onsemi.com

6

PACKAGE DIMENSIONS − ESD8101 (01005)

DSN2, 0.435x0.23, 0.27P, (01005)

CASE 152AK

ISSUE A

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

A

B

E

D

BOTTOM VIEW

b

L

0.02 C

TOP VIEW

A

A1

C

SEATING

PLANE

SIDE VIEW

DIM

MIN

MAX

MILLIMETERS

A

0.165

0.195

A1

−−−

0.030

b

0.177

0.193

D

0.435 BSC

E

0.230 BSC

SOLDER FOOTPRINT*

DIMENSIONS: MILLIMETERS

0.44

0.23

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

1

L

0.112

0.128

0.16

RECOMMENDED

1

PIN 1

INDICATOR

e

0.270 BSC

A

M

0.05

B

C

A

M

0.05

B

C

2X

e

2X

2X

0.02 C

2X

2X

0.02 C

0.05 C

2X

2X

2X

PACKAGE DIMENSIONS − ESD8111 (0201)

WLCSP2, 0.6x0.3

CASE 567AV

ISSUE B

SOLDER FOOTPRINT*

DIMENSIONS: MILLIMETERS

0.81

0.33

0.28

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

RECOMMENDED

2X

2X

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

A B

E

D

BOTTOM VIEW

b

0.05

B

A

C

0.02 C

TOP VIEW

0.02 C

A

A1

0.02 C

0.02 C

C

SEATING

PLANE

SIDE VIEW

DIM

MIN

NOM

MILLIMETERS

A

0.250

0.275

A1 0.000

0.250

b

0.140

0.155

D

E

L

0.190

0.215

e

0.36 BSC

2X

2X

2X

L

2X

e

MAX

0.570

0.600

0.270

0.300

0.300

0.500

0.170

0.240

0.630

0.330