MAX4738 datasheet(2/15 Pages) MAXIM

Part #	MAX4738

Description	4.5Ω Quad SPST Analog Switches in UCSP

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Manufacturer	MAXIM [Maxim Integrated Products]

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4.5

Ω Quad SPST Analog Switches in UCSP

2

_______________________________________________________________________________________

ABSOLUTE MAXIMUM RATINGS

ELECTRICAL CHARACTERISTICS—Single +3V Supply

(V+ = +2.7V to +3.6V, VIH = +1.4V, VIL = +0.5V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at V+ = +3.0V,

TA = +25°C, unless otherwise noted.) (Notes 3, 4)

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to

absolute maximum rating conditions for extended periods may affect device reliability.

(All Voltages Referenced to GND)

V+, IN_...................................................................-0.3V to +6.0V

COM_, NO_, NC_ (Note 1) ...........................-0.3V to (V+ + 0.3V)

Continuous Current COM_, NO_, NC_ ...........................±100mA

Peak Current COM_, NO_, NC_

(pulsed at 1ms, 10% duty cycle)................................±200mA

Continuous Power Dissipation (TA = +70°C)

14-Pin TSSOP (derate 6.3mW/°C above +70°C) .........500mW

16-Bump UCSP (derate 8.3mW/°C above +70°C) ......659mW

ESD Method 3015.7 .............................................................>2kV

Operating Temperature Range ...........................-40°C to +85°C

Junction Temperature ......................................................+150°C

Storage Temperature Range .............................-65°C to +150°C

Lead Temperature (soldering, 10s) .................................+300°C

Bump Temperature (soldering) (Note 2)

Infrared (15s) ...............................................................+220°C

Vapor Phase (60s) .......................................................+215°C

Note 1: Signals on COM_, NO_, or NC_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to maxi-

mum current rating.

Note 2: This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device

can be exposed to during board level solder attach and rework. This limit permits only the use of the solder profiles recom-

mended in the industry standard specification, JEDEC 020A, paragraph 7.6, table 3 for IR/VPR and convection reflow.

Preheating is required. Hand or wave soldering is not allowed.

PARAMETER

SYMBOL

CONDITIONS

TA

MIN

TYP

MAX

UNITS

Analog Signal Range

VCOM_,

VNO_, VNC_

0V+

V

ANALOG SWITCH

+25°C

3.0

4.5

On-Resistance (Note 5)

RON

V+ = 2.7V, ICOM_ = 10mA;

VNO_ or VNC_ = 1.5V

TMIN to

TMAX

5

Ω

+25°C

0.1

0.4

On-Resistance Match Between

Channels (Notes 5, 6)

∆RON

V+ = 2.7V, ICOM_ = 10mA;

VNO_ or VNC_ = 1.5V

TMIN to

TMAX

0.5

Ω

+25°C

0.6

1.2

On-Resistance Flatness (Note 7)

RFLAT(ON)

V+ = 2.7V, ICOM_ = 10mA;

VNO_ or VNC_ = 1.0V, 1.5V, 2.0V

TMIN to

TMAX

1.5

Ω

+25°C

-0.5

+0.01

+0.5

NO_, NC_ Off-Leakage Current

(Note 8)

INO_(OFF),

INC_(OFF)

V+ = 3.6V, VCOM_ = 0.3V, 3.3V;

VNO_ or VNC_ = 3.3V, 0.3V

TMIN to

TMAX

-1

+1

nA

+25°C

-0.5

+0.01

+0.5

COM_ Off-Leakage Current

(Note 8)

ICOM_(OFF)

V+ = 3.6V, VCOM_ = 0.3V, 3.3V;

VNO_ or VNC_ = 3.3V, 0.3V

TMIN to

TMAX

-1

+1

nA

+25°C

-1

+0.01

+1

COM_ On-Leakage Current

(Note 8)

ICOM_(ON)

V+ = 3.6V, VCOM_ = 0.3V, 3.3V;

VNO_ or VNC_ = 0.3V, 3.3V, or

floating

TMIN to

TMAX

-2

+2

nA

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