PACDN006

http://onsemi.com

6

PACKAGE DIMENSIONS

MSOP8

CASE 846AB−01

ISSUE O

S

B

M

0.08 (0.003)

T

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE

BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED

0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.

5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.

b

e

PIN 1 ID

8 PL

0.038 (0.0015)

−T−

SEATING

PLANE

A

A1

c

L

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

8X

8X

6X

mm

inches

SCALE 8:1

1.04

0.041

0.38

0.015

5.28

0.208

4.24

0.167

3.20

0.126

0.65

0.0256

DIM

A

MIN

NOM

MAX

MIN

MILLIMETERS

−−

−−

1.10

−−

INCHES

A1

0.05

0.08

0.15

0.002

b

0.25

0.33

0.40

0.010

c

0.13

0.18

0.23

0.005

D

2.90

3.00

3.10

0.114

E

2.90

3.00

3.10

0.114

e

0.65 BSC

L

0.40

0.55

0.70

0.016

−−

0.043

0.003

0.006

0.013

0.016

0.007

0.009

0.118

0.122

0.118

0.122

0.026 BSC

0.021

0.028

NOM

MAX

4.75

4.90

5.05

0.187

0.193

0.199

D

D

E