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LP5907A28YKMR Datasheet(PDF) 4 Page - Texas Instruments |
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LP5907A28YKMR Datasheet(HTML) 4 Page - Texas Instruments |
4 / 36 page 4 LP5907 SNVS798L – APRIL 2012 – REVISED SEPTEMBER 2016 www.ti.com Product Folder Links: LP5907 Submit Documentation Feedback Copyright © 2012–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to the GND pin. (3) Abs Max VOUT is the lessor of VIN + 0.3 V, or 6 V. (4) Internal thermal shutdown circuitry protects the device from permanent damage. 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VIN Input voltage –0.3 6 V VOUT Output voltage –0.3 See(3) VEN Enable input voltage –0.3 6 Continuous power dissipation(4) Internally Limited W TJMAX Junction temperature 150 °C Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1000 (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to the GND pin. (3) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX). See Applications and Implementation. 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VIN Input supply voltage 2.2 5.5 V VEN Enable input voltage 0 5.5 IOUT Output current 0 250 mA TJ Junction temperature –40 125 °C TA Ambient temperature(3) –40 85 °C |
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