Features

●

Low profile space

●

Ideal for automated placement

●

Glass passivated chip junctions

●

Low forward voltage drop

●

Low leakage current

●

High forward surge capability

●

High temperature soldering：

260℃/10 seconds at terminals

●

Component in accordance to

RoHS 2002/95/1 and WEEE 2002/96/EC

Mechanical Date

●

Case: JEDEC SOD-123FL molded plastic

body over glass passivated chip

●

Terminals: Solder plated, solderable per

J-STD-002B and JESD22-B102D

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Polarity: Laser band denotes cathode end

Maximum Ratings & Thermal Characteristics & Electrical Characteristics

(TA = 25

°C unless otherwise noted)

Symbol DFR1A DFR1B DFR1D DFR1G DFR1J DFR1K DFR1M UNIT

50

100

200

400

600

800

1000

V

35

70

140

280

420

560

700

V

50

100

200

400

600

800

1000

V

A

A

V

μA

250

nS

p F

℃

Operating junction and storage

temperature range

–55 to +150

Maximum reverse recovery time

150

500

Typical junction capacitance at 4.0 V ,1MHz

15

Maximum instantaneous forwad voltage at 1.0A

1.3

Maximum DC reverse current

at Rated DC blocking voltage

5.0

50

Maximum average forward rectified current

1

Peak forward surge current 8.3 ms single half

sine-wave superimposed on rated load

25

Maximum repetitive peak reverse voltage

Maximum RMS voltage

Maximum DC blocking voltage

DFR1A~DFR1M

Surface Mount Fast Recovery Rectifiers