7.125

3.50

3.50

E

2X6 PCB LAYOUT

KEEP-OUT AREAS

COMPONENT

KEEP-OUT AREAS

COMPONENT

X

XY

Y

9.80

12X 1.60±0.03

0.50

3X 3.50

6.29

4X 8.00

6X 14.25

99X 0.56±0.05(TYP.)

13.28

87.50

4.50

1.72

58.00

B

C

D

12

A

3

2

1

4

B

A

56

C

MATERIAL AND FINISH

SEE NOTES

FEB 12/14

FEB 12/14

FEB10/14

A4

3:2

SHEET 4 OF 5

C

P-UE86-3G6420-X0X61

ECN Exxxxx

J. SI

P. OU

J. SI

DIMENSIONS ARE IN MILLIMETERS

REFERENCE IN PARENTHESES

GENERAL TOLERANCES

1 DECIMAL PLACE

2 DECIMAL PLACE

3 DECIMAL PLACE

ANGULAR DEGREES

ENG. REL. NO.

UNLESS SPECIFIED OTHERWISE

THIRD

ANGLE

PROJECTION

REF.

DWG APP'D

Q.A. APP'D

M.E. APP'D

CHECKED

DRAWN

03554

DO NOT

SCALE

DRAWING

DWG SIZE:

CODE ID NO.

Amphenol High Speed Interconnects

A Division of Amphenol Corp. www.amphenolcanada.com

DWG. NO.

REV

SCALE:

THIS DOCUMENT CONTAINS PROPRIETARY INFORMATION AND SUCH INFORMATION MAY NOT BE DISCLOSED TO OTHERS FOR ANY PURPOSE OR 

USED FOR MANUFACTURING PURPOSES WITHOUT WRITTEN PERMISSION FROM AMPHENOL CANADA CORP.

3

0.25

0.15

N/A

1

2X6 SFP ULTRAPORT WITH LIGHT PIPE

OPTIONS AND EMI GASKET VERSION

NOTES:

1. 0.56 mm DIAMETER HOLES ARE

CHASSIS GROUND (99HOLES).

REVISIONS

REV.

ECN

DESCRIPTION

DATE

APPROVED

A

INITIAL RELEASE

02/12/2014

J. SI

B

UPDATE PLATING OPTIONS

JUN 25/14

J.SI

C

UPDATE NOTES

AUG 19/14

J.SI