CM1402

http://onsemi.com

8

PACKAGE DIMENSIONS

WLCSP10, 1.96x1.33

CASE 567BL−01

ISSUE O

SEATING

PLANE

0.05 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

2X

DIM

A

MIN

MAX

0.56

MILLIMETERS

A1

D

1.96 BSC

E

b

0.29

0.35

eD

0.50 BSC

0.72

D

E

A B

PIN A1

REFERENCE

eD/2

A

0.05

B

C

0.03 C

0.05 C

10X

b

12 3

C

B

A

0.05 C

A

A1

A2

C

0.21

0.27

1.33 BSC

eE

0.435 BSC

0.50

0.25

10X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.25

0.87

0.44

0.05 C

2X

TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

eE

A2

0.40 REF

RECOMMENDED

A1

PACKAGE

OUTLINE

45 6

eD

PITCH

0.25

OptiGuard Option

ON Semiconductor and

are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

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CM1402/D

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