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LP3882ESX-1.2 Datasheet(PDF) 10 Page - National Semiconductor (TI) |
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LP3882ESX-1.2 Datasheet(HTML) 10 Page - National Semiconductor (TI) |
10 / 12 page Application Hints (Continued) As shown in the graph below, increasing the copper area beyond 1 square inch produces very little improvement. The minimum value for θ JA for the TO-263 package mounted to a PCB is 32˚C/W. Figure 2 shows the maximum allowable power dissipation for TO-263 packages for different ambient temperatures, assuming θ JA is 35˚C/W and the maximum junction tempera- ture is 125˚C. 20063226 FIGURE 2. Maximum power dissipation vs ambient temperature for TO-263 package www.national.com 10 |
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