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AS8C403625 Datasheet(PDF) 1 Page - Alliance Semiconductor Corporation |
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AS8C403625 Datasheet(HTML) 1 Page - Alliance Semiconductor Corporation |
1 / 19 page SEPTEMBER 2010 DSC-5280/08 1 . Features ◆ 128K x 36, 256K x 18 memory configurations ◆ ◆ ◆ ◆ ◆ Supports fast access times: Commercial: – 7.5ns up to 117MHz clock frequency ◆ LBO input selects interleaved or linear burst mode ◆ ◆ ◆ ◆ ◆ Self-timed write cycle with global write control ( GW),bytewrite enable ( BWE), and byte writes (BWx) ◆ ◆ ◆ ◆ ◆ 3.3V core power supply ◆ ◆ ◆ ◆ ◆ Power down controlled by ZZ input ◆ ◆ ◆ ◆ ◆ 3.3V I/O ◆ ◆ ◆ ◆ ◆ Optional - Boundary Scan JTAG Interface (IEEE 1149.1 compliant) ◆ ◆ ◆ ◆ ◆ Packaged in a JEDEC Standard 100-pin plastic thin quad flatpack (TQFP), Pin Description Summary NOTE: 1. BW3 and BW4 are not applicable for the AS8C401825. Description TheAS8C403625/1825 are high-speed SRAMs organized as 128K x 36/256K x 18. The AS8C403625/1825 SRAMs contain write, data, address and control registers. There are no registers in the data output path (flow-through architecture). Internal logic allows the SRAM to gen- erate a self-timed write based upon a decision which can be left until the end of the write cycle. The burst mode feature offers the highest level of performance to the system designer, as the AS8C403625/1825 can provide four cycles of data for a single address presented to the SRAM. An internal burst address counter accepts the first cycle address from the processor, initiating the access sequence. The first cycle of output data will flow-through from the array after a clock-to-data access time delay from the rising clock edge of the same cycle. If burst mode operation is selected ( ADV=LOW), the subsequent three cycles of output data will be available to the user on the next three rising clock edges. The order of these three addresses are defined by the internal burst counter and the LBO input pin. The AS8C403625/1825 SRAMs utilize IDT’s latest high-performance CMOS process and are packaged in a JEDEC standard 14mm x 20mm 100-pin thin plastic quad flatpack (TQFP) A0-A17 Address Inputs Input Synchronous CE Chip Enable Input Synchronous CS0, CS1 Chip Selects Input Synchronous OE Output Enable Input Asynchronous GW Global Write Enable Input Synchronous BWE Byte Write Enable Input Synchronous BW1, BW2, BW3, BW4(1) Individual Byte Write Selects Input Synchronous CLK Clock Input N/A ADV Burst Address Advance Input Synchronous ADSC Address Status (Cache Controller) Input Synchronous ADSP Address Status (Processor) Input Synchronous LBO Linear / Interleaved Burst Order Input DC TMS Test Mode Select Input Synchronous TDI Test Data Input Input Synchronous TCK Test Clock Input N/A TDO Test Data Output Output Synchronous TRST JTAG Reset (Optional) Input Asynchronous ZZ Sleep Mode Input Asynchronous I/O0-I/O31, I/OP1-I/OP4 Data Input / Output I/O Synchronous VDD, VDDQ Core Power, I/O Power Supply N/A VSS Ground Supply N/A 5280 tbl 01 128K X 36, 256K X 18 3.3V Synchronous SRAMs 3.3V I/O, Flow-Through Outputs Burst Counter, Single Cycle Deselect AS8C403625 AS8C401825 |
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