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AS8C401800 Datasheet(PDF) 2 Page - Alliance Semiconductor Corporation

Part # AS8C401800
Description  Power down controlled by ZZ input
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Manufacturer  ALSC [Alliance Semiconductor Corporation]
Direct Link  https://www.alliancememory.com
Logo ALSC - Alliance Semiconductor Corporation

AS8C401800 Datasheet(HTML) 2 Page - Alliance Semiconductor Corporation

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AS8C403600, AS8C401800, 128K x 36, 256K x 18, 3.3V Synchronous SRAMs with
3.3V I/O, Pipelined Outputs, Burst Counter, Single Cycle Deselect
Commercial Temperature Range
Pin Definitions(1)
NOTE:
1. All synchronous inputs must meet specified setup and hold times with respect to CLK.
Symbol
Pin Function
I/O
Active
Description
A0-A17
Address Inputs
I
N/A
Synchronous Address inputs. The address register is triggered by a combination of the rising edge
of CLK and ADSC Lo w o r ADSP Low and CE Lo w.
ADSC
Address Status
(Cache Controller)
ILOW
Synchronous Address Status from Cache Controller. ADSC is an active LOWinputthatis used to load
the address registers with new addresses.
ADSP
Address Status
(Processor)
ILOW
Synchronous Address Status from Processor. ADSP is an ac tive LOW input that is us ed to load the
address registers with new addresses. ADSP is gated by CE.
ADV
Burst Address
Advance
ILOW
Synchronous Address Advance. ADV is an active LOW inputthatis used to advance the internal
burst counter, controlling burst access after the initial address is loaded. When the input is HIGH the
burstc ounter is noti ncremented; thatis, there is no address advance.
BWE
Byte Write Enable
I
LOW
Synchronous byte write enable gates the byte write inputs BW1-BW4. If BWE is LOW at the rising
edge of CLK then BWx inputs are p assed to the nextstage in the circuit. If BWE is HIGH then the
byte write inputs are blocked and only GW c an initiate a w rite cycle.
BW1
-BW4
Individual Byte
Write Enables
ILOW
Synchronous byte write enables. BW1 controls I/O0-7, I/OP1, BW2 controls I/O8-15, I/OP2, etc. Any
active byte write causes all outputs to be disabled.
CE
Chip Enable
I
LOW
Synchronous chip enable. CE is used with CS0 and CS1 to enable the AS8C403600/1800. CE also g ates
ADSP
.
CLK
Clock
I
N/A
This is the clock i nput. A ll timing references fo r the d evice are made with respectto this input.
CS0
Chip Select 0
I
HIGH
Synchronous active HIGH chip select. CS0 is used with CE and CS1 to e nable the chip.
CS1
Chip Select 1
I
LOW
Synchronous active LOW chip select. CS1 is used with CE and CS0 to e nable the chip.
GW
Global Write
Enable
ILOW
Synchronous global write enable. This input will write all four 9-bit data bytes when LOW on the rising
edge of CLK. GW supersedes individual byte write enables.
I/O0-I/O31
I/OP1-I/OP4
Data Input/Output
I/O
N/A
Synchronous d ata input/output(I/O) p ins. B oth the d ata inputp ath and d ata o utputp ath are registered
and triggered by the rising edge of CLK.
LBO
Linear Burst Order
I
LOW
Asynchronous burst order selection input. When LBO is HIGH, the interleaved burst sequence is
selected. When LBO is LOW the Linear burst sequence is selected. LBO is a s tatic input and must
not change state while the device is operating.
OE
Output Enable
I
LOW
Asynchronous output enable. When OE is LOW the data output drivers are enabled on the I/O pins if
the chip is also selected. When OE is HIGH the I/O pins are in a high-impedance state.
TMS
Test ModeSelect
I
N/A
Gives input command for TAP controller. Sampled on rising edge of TDK. This pin has an internal
pullup.
TDI
TestData Input
I
N/A
Serial input of registers placed between TDI and TDO. Sampled on rising edge of TCK. This pin has
an internal pullup.
TCK
TestClock
I
N/A
Clock input of TAP controller. Each TAP event is clocked. Test inputs are captured on rising edge of
TCK, while test outputs are driven from the falling edge of TCK. This pin has an internal pullup.
TDO
TestDataOutput
O
N/A
Serial output of registers placed between TDI and TDO. This output is active depending on the state
of the TAP controller.
ZZ
Sleep Mode
I
HIGH
Asynchronous sleep mode input. ZZ HIGH will gate the CLK internally and power down the
AS8C403600/1800 to its lowest power consumption level. Data retention is guaranteed in Sleep
Mode.This pin has an internal pull down.
VDD
Power Supply
N/A
N/A
3.3V c ore p ower supply.
VDDQ
Power Supply
N/A
N/A
3.3V I/O Supply.
VSS
Ground
N/A
N/A
Ground.
NC
No Connect
N/A
N/A
NC pins are note lectrically connected to the d evice.
5279 tbl 02


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