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SN74LVC1G3157DRLR Datasheet(PDF) 6 Page - Texas Instruments |
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SN74LVC1G3157DRLR Datasheet(HTML) 6 Page - Texas Instruments |
6 / 40 page 6 SN74LVC1G3157 SCES424L – JANUARY 2003 – REVISED MAY 2017 www.ti.com Product Folder Links: SN74LVC1G3157 Submit Documentation Feedback Copyright © 2003–2017, Texas Instruments Incorporated (1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. See the TI application report, Implications of Slow or Floating CMOS Inputs (SCBA004). 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VCC Supply voltage 1.65 5.5 V VI/O Switch input or output voltage 0 VCC V VIN Control input voltage 0 5.5 V VIH High-level input voltage, control input VCC = 1.65 V to 1.95 V VCC × 0.75 V VCC = 2.3 V to 5.5 V VCC × 0.7 VIL Low-level input voltage, control input VCC = 1.65 V to 1.95 V VCC × 0.25 V VCC = 2.3 V to 5.5 V VCC × 0.3 Δt/Δv Input transition rise or fall rate VCC = 1.65 V to 1.95 V 20 ns/V VCC = 2.3 V to 2.7 V 20 VCC = 3 V to 3.6 V 10 VCC = 4.5 V to 5.5 V 10 TA Operating free-air temperature BGA package (YZP) –40 85 °C All other packages (DBV, DCK, DRL, DRY, DSF) –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 6.4 Thermal Information THERMAL METRIC(1) SN74LVC1G3157 UNIT DBV (SOT-23) DCK (SC70) DRL (SOT) DRY (SON) DTB (X2SON) YZP (DSBGA) 6 PINS 6 PINS 6 PINS 6 PINS 6 PINS 6 PINS RθJA Junction-to-ambient thermal resistance 234.9 269.5 244.1 284.2 324.5 129.4 °C/W RθJC(top) Junction-to-case (top) thermal resistance 150.4 189.5 112.5 138.6 150.5 1.9 °C/W RθJB Junction-to-board thermal resistance 86.4 84.7 109.9 170.9 239.0 40.0 °C/W ψJT Junction-to-top characterization parameter 60.8 62.7 9.3 13.7 17.2 0.6 °C/W ψJB Junction-to-board characterization parameter 86.1 84.0 109.3 167.9 238.3 40.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance n/a n/a n/a n/a n/a n/a °C/W |
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