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AS4C128M16D3-12BCN Datasheet(PDF) 2 Page - Alliance Semiconductor Corporation |
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AS4C128M16D3-12BCN Datasheet(HTML) 2 Page - Alliance Semiconductor Corporation |
2 / 84 page AS4C128M16D3 Confidential 2 Rev. 3.0 Aug. /2014 2Gb (128M x 16 bit) DDR3 Synchronous DRAM (SDRAM) Confidential Advanced (Rev. 3.0, Aug. /2014) Features JEDEC Standard Compliant Power supplies: VDD & VDDQ = +1.5V 0.075V Operating temperature: - Commercial (0 ~ 95°C) - Industrial (-40 ~ 95°C) Supports JEDEC clock jitter specification Fully synchronous operation Fast clock rate: 800MHz Differential Clock, CK & CK# Bidirectional differential data strobe - DQS & DQS# 8 internal banks for concurrent operation 8n-bit prefetch architecture Internal pipeline architecture Precharge & active power down Programmable Mode & Extended Mode registers Additive Latency (AL): 0, CL-1, CL-2 Programmable Burst lengths: 4, 8 Burst type: Sequential / Interleave Output Driver Impedance Control 8192 refresh cycles / 64ms - Average refresh period 7.8μs @ -40 ℃ ≦TC≦ +85℃ 3.9μs @ +85 ℃ <TC≦ +95℃ Write Leveling OCD Calibration Dynamic ODT (Rtt_Nom & Rtt_WR) RoHS compliant Auto Refresh and Self Refresh 96-ball 9 x 13 x 1.2mm FBGA package - All parts are ROHS Compliant Overview The 2Gb Double-Data-Rate-3 DRAMs is double data rate architecture to achieve high-speed operation. It is internally configured as an eight bank DRAM. The 2Gb chip is organized as 16Mbit x 16 I/Os x 8 bank devices. These synchronous devices achieve high speed double-data-rate transfer rates of up to 1600 Mb/sec/pin for general applications. The chip is designed to comply with all key DDR3 DRAM key features and all of the control and address inputs are synchronized with a pair of externally supplied differential clocks. Inputs are latched at the cross point of differential clocks (CK rising and CK# falling). All I/Os are synchronized with differential DQS pair in a source synchronous fashion. These devices operate with a single 1.5V ± 0.075V power supply and are available in BGA packages. Table 1. Speed Grade Information Speed Grade Clock Frequency CAS Latency tRCD (ns) tRP (ns) DDR3-1600 800 MHz 11 13.75 13.75 Table 2 – Ordering Information for ROHS Compliant Products Product part No Org Temperature Package AS4C128M16D3-12BCN 128M x 16 Commercial(Extended) 0°C to 95°C 96-ball FBGA AS4C128M16D3-12BIN 128M x 16 Industrial -40°C to 95°C 96-ball FBGA |
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