TLV803, TLV853, TLV863

SBVS157C – APRIL 2011 – REVISED SEPTEMBER 2015

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7 Specifications

7.1 Absolute Maximum Ratings

(1)

over operating junction temperature range (unless otherwise noted)

MIN

MAX

UNIT

0

7

Voltage

V

–0.3

+7

5

–5

Current

mA

±20

±20

–40

125

Temperature

°C

–65

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to GND. For reliable operation the device should not be operated at 7 V for more than t = 1000h

continuously

7.2 ESD Ratings

VALUE

UNIT

±2000

Electrostatic

V

discharge

±500

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.3 Thermal Information

TLV8x3

DBZ (SOT-23)

UNITS

3 PINS

Junction-to-ambient thermal resistance

328.5

°C/W

Junction-to-case (top) thermal resistance

135.4

°C/W

Junction-to-board thermal resistance

58.3

°C/W

Junction-to-top characterization parameter

5.2

°C/W

Junction-to-board characterization parameter

59.6

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.4 Recommended Operating Conditions

at specified temperature range (unless otherwise noted)

MIN

MAX

UNIT

Supply voltage

1.1

6

V

Operating junction temperature

–40

125

°C

4

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