HMPP-3865 datasheet(2/10 Pages) BOARDCOM

Part #	HMPP-3865

Description	MiniPak Surface Mount RF PIN Diodes

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Manufacturer	BOARDCOM [Broadcom Corporation.]

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HMPP-386x Series Absolute Maximum Ratings[1], T

C = 5°C

MiniPak 141 /

Symbol

Parameter

Units

MiniPak QFN

I

f

Forward Current (1 µs pulse)

Amp

1

P

IV

Peak Inverse Voltage

V

100

T

j

Junction Temperature

°C

150

T

stg

Storage Temperature

°C

-65 to +150

θ

jc

Thermal Resistance[2]

°C/W

150

Notes:

1. Operation in excess of any one of these

conditions may result in permanent dam-

age to the device.

2. T

C = +25°C, where TC is defined to be the

temperature at the package pins where

contact is made to the circuit board.

MiniPak141

Electrical Specifications, T

C = +5°C, each diode

Part Number

Package

Minimum Breakdown

Typical Series

HMPP-

Marking Code

Lead Code

Configuration

Voltage (V)

Resistance(Ω)

3860

H

0

Single

50

3.0/1.5*

3862

F

2

Anti-parallel

3865

E

5

Parallel

Test Conditions

V

R = VBR

I

F = 10 mA

Measure

f = 100 MHz

I

R ≤ 10 µA

*I

F = 100 mA

ESD WARNING:

Handling Precautions Should Be Taken

To Avoid Static Discharge.

MiniPak141

Typical Parameters, T

C = +5°C

Part Number

Total Resistance

Carrier Lifetime

Reverse Recovery Time

Total Capacitance

HMPP-

R

T (Ω)

τ (ns)

T

rr (ns)

C

T (pF)

3860

22

500

80

0.20

3862

3865

Test Conditions

I

F = 1 mA

I

F = 50 mA

V

R = 10 V

V

R = 50V

f = 100 MHz

T

R = 250 mA

I

F = 20 mA

f = 1 MHz

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HMPP-3865 Datasheet(PDF) 2 Page - Broadcom Corporation.

HMPP-3865 Datasheet(HTML) 2 Page - Broadcom Corporation.

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