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ISO7740-Q1, ISO7741-Q1, ISO7742-Q1

SLLSEU0A – NOVEMBER 2016 – REVISED MAY 2017

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Product Folder Links: ISO7740-Q1 ISO7741-Q1 ISO7742-Q1

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Copyright © 2016–2017, Texas Instruments Incorporated

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report (SPRA953).

6.4 Thermal Information

ISO774x-Q1

UNIT

DW (SOIC)

DBQ (QSOP)

16 Pins

16 Pins

Junction-to-ambient thermal resistance

83.4

109

°C/W

Junction-to-case(top) thermal resistance

46

54.4

°C/W

Junction-to-board thermal resistance

48

51.9

°C/W

Junction-to-top characterization parameter

19.1

14.2

°C/W

Junction-to-board characterization parameter

47.5

51.4

°C/W

Junction-to-case(bottom) thermal resistance

—

—

°C/W

6.5 Power Rating

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

ISO7740-Q1

Maximum power dissipation

Input a 50-MHz 50% duty cycle square wave

200

mW

Maximum power dissipation by side-1

40

mW

Maximum power dissipation by side-2

160

mW

ISO7741-Q1

Maximum power dissipation

Input a 50-MHz 50% duty cycle square wave

200

mW

Maximum power dissipation by side-1

50

mW

Maximum power dissipation by side-2

150

mW

ISO7742-Q1

Maximum power dissipation

Input a 50-MHz 50% duty cycle square wave

200

mW

Maximum power dissipation by side-1

100

mW

Maximum power dissipation by side-2

100

mW