Confidential

Final Datasheet Version 1.0

Oct 21

Absolute Maximum Ratings

(Note 1)

Symbol

Parameter

Min

Max

Unit

Supply Voltage

-0.3

36

V

Gate Driver Output

-0.3

14

V

VDD Pin

-0.3

14

V

Voltage Level on EN, CS, PWMI, COMP, FSW, VLDO, ISET,

OVP, VADIM Pin

-0.3

7

V

LED Current Sink Pin

-0.3

65

V

LED Current Sink Pin

200

mA

Soldering Lead/ Pad Temperature 10sec

300

°C

Junction Temperature

-40

+150

°C

Storage Temperature

-65

+150

°C

ESD

HBM on All Pins (Note 2)

-2000

+2000

V

MM on All Pins (Note 3)

-200

+200

Note 1: Stresses beyond the above listed maximum ratings may damage the device permanently. Operating above the recommended

conditions for extended time may stress the device and affect device reliability. Also the device may not operate normally above the

recommended operating conditions. These are stress ratings only.

Note 2: ESD tested per JESD22A-114.

Note 3: ESD tested per JESD22A-115.

Recommended Operating Conditions

(Note 1)

Parameter

Min

Max

Unit

Supply Input Voltage

8

36

V

LED Current Sink Pin

50

150

mA

LED Current Sink Pin

65

V

Ambient Temperature (Note 2)

-40

+85

°C

Note 1: Normal operation of the device is not guaranteed if operating the device over outside range of recommended conditions.

Note 2: The ambient temperature may have to be derated if used in high power dissipation and poor thermal resistance conditions.

Package Thermal Resistance

(Note 1)

Parameter

θJA

θJC

Unit

MAP3205SIRH

20 Leads SOIC

54

26

℃/W

MAP3205TERH

20 Leads E-TSSOP

43

4

℃/W

Note 1: Measured on JESD51-7, Multi-layer PCB