TPS61030, TPS61031, TPS61032

SLUS534G – SEPTEMBER 2002 – REVISED MARCH 2015

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8 Specifications

8.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

Input voltage on LBI

–0.3

3.6

V

Input voltage on SW, VOUT, LBO, VBAT, SYNC, EN, FB

–0.3

7

V

Maximum junction temperature

–40

150

°C

Storage temperature range

–65

150

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating

Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

8.2 ESD Ratings

MIN

MAX

UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all

–2000

2000

Electrostatic discharge

V

Charged device model (CDM), per JEDEC specification JESD22-

–1000

1000

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

8.3 Recommended Operating Conditions

MIN

NOM MAX

UNIT

Supply voltage at VBAT

1.8

5.5

V

Operating ambient temperature range

-40

85

°C

Operating virtual junction temperature range

-40

125

°C

8.4 Thermal Information

TPS6103x

PWP

RSA

UNIT

16 PINS

16 PINS

Junction-to-ambient thermal resistance

46.9

35.5

Junction-to-case (top) thermal resistance

25.8

36.7

Junction-to-board thermal resistance

19.4

12.9

°C/W

Junction-to-top characterization parameter

0.8

0.5

Junction-to-board characterization parameter

19.3

12.9

Junction-to-case (bottom) thermal resistance

2.2

3.8

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

4

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