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TPS2041BDGNRG4 Datasheet(PDF) 7 Page - Texas Instruments |
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TPS2041BDGNRG4 Datasheet(HTML) 7 Page - Texas Instruments |
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7 / 59 page  7 TPS2041B, TPS2042B, TPS2043B, TPS2044B TPS2051B, TPS2052B, TPS2053B, TPS2054B www.ti.com SLVS514M – JUNE 2010 – REVISED JUNE 2016 Product Folder Links: TPS2041B TPS2042B TPS2043B TPS2044B TPS2051B TPS2052B TPS2053B TPS2054B Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated (1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. (2) All voltages are with respect to GND. 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT VI(IN), VI(INx) Input voltage (2) –0.3 6 V VO(OUT), VO(OUTx) (2) Output voltage –0.3 6 V VI(EN), VI(ENx), VI(EN), VI(ENx) Input voltage –0.3 6 V VI(/OC), VI(OCx) Voltage range –0.3 6 V IO(OUT), IO(OUTx) Continuous output current Internally limited Continuous total power dissipation See Dissipation Ratings TJ Operating virtual junction temperature –40 125 °C Tstg Storage temperature –65 150 °C (1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. (2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 7.2 ESD Ratings VALUE UNIT V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±500 7.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) MIN NOM MAX UNIT VI(IN), VI(INx) Input voltage 2.7 5.5 V VI(EN), VI(ENx), VI(EN), VI(ENx) Input voltage 0 5.5 V IO(OUT), IO(OUTx) Continuous output current 0 500 mA TJ Operating virtual junction temperature –40 125 °C (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report. 7.4 Thermal Information THERMAL METRIC(1) TPS2042xx and TPS2053xx UNIT D (SOIC) DBV (SOT-23) DGN (HVSSOP) DRB (SON) 8 PINS 16 PINS 5 PINS 8 PINS 8 PINS RθJA Junction-to-ambient thermal resistance 119.3 81.6 208.6 53.6 47.5 °C/W RθJC(top) Junction-to-case (top) thermal resistance 67.6 42.7 122.9 58.7 53 °C/W RθJB Junction-to-board thermal resistance 59.6 39.1 37.8 35.5 14.2 °C/W ψJT Junction-to-top characterization parameter 20.3 10.4 14.6 2.7 1.2 °C/W ψJB Junction-to-board characterization parameter 59.1 38.8 36.9 35.3 14.2 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance N/A N/A N/A 6.7 7.3 °C/W |
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