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TPS2552, TPS2553, TPS2552-1, TPS2553-1

SLVS841F – NOVEMBER 2008 – REVISED AUGUST 2016

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Product Folder Links: TPS2552 TPS2553 TPS2552-1 TPS2553-1

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Copyright © 2008–2016, Texas Instruments Incorporated

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

(3)

Surges per EN61000-4-2. 1999 applied to output terminals of EVM. These are passing test levels, not failure threshold.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

Charged device model (CDM), per JEDEC specification JESD22-

±500

±8000

±15000

(1)

See Power Dissipation and Junction Temperature for details on how to calculate maximum junction temperature for specific applications

and packages.

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Input voltage, IN

2.5

6.5

V

Enable voltage

TPS2552/52-1

0

6.5

V

Enable voltage

TPS2553/53-1

0

6.5

V

High-level input voltage on EN or EN

1.1

V

Low-level input voltage on EN or EN

0.66

Continuous output current,

OUT

–40 °C

0

1.2

A

–40 °C

0

1.5

Current-limit threshold resistor range (nominal 1%) from ILIM to GND

15

232

kΩ

Continuous FAULT sink current

0

10

mA

Input de-coupling capacitance, IN to GND

0.1

µF

Operating virtual junction

–40

125

°C

–40

105

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

TPS2552

TPS2553

UNIT

DBV (SOT-23)

DRV (WSON)

DBV (SOT-23)

DRV (WSON)

6 PINS

6 PINS

6 PINS

6 PINS

Junction-to-ambient thermal resistance

182.6

72

182.6

72

°C/W

p)

Junction-to-case (top) thermal resistance

122.2

85.3

122.2

85.3

°C/W

Junction-to-board thermal resistance

29.4

41.3

29.4

41.3

°C/W

Junction-to-top characterization parameter

20.8

1.7

20.8

1.7

°C/W

Junction-to-board characterization parameter

28.9

41.7

28.9

41.7

°C/W

ot)

Junction-to-case (bottom) thermal resistance

—

11.1

—

11.1

°C/W