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HPA01043PWPR Datasheet(PDF) 5 Page - Texas Instruments

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Part # HPA01043PWPR
Description  High-Power/High-Efficiency PoE Interface and DC-DC Controller
Download  45 Pages
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Manufacturer  TI1 [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI1 - Texas Instruments

HPA01043PWPR Datasheet(HTML) 5 Page - Texas Instruments

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TPS23754, TPS23754-1, TPS23756
www.ti.com
SLVS885H – OCTOBER 2008 – REVISED OCTOBER 2015
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted). Voltage with respect to VSS (unless otherwise noted)
(1)
MIN
NOM
MAX
UNIT
ARTN, COM, PPD, RTN, VDD, VDD1
0
57
V
T2P, VC to [ARTN, COM]
0
18
V
Input voltage range
APD, CTL, DT to [ARTN, COM]
0
VB
V
CS to [ARTN, COM]
0
2
V
Continuous RTN current (TJ ≤ 125°C)
(2)
825
mA
Sourcing current
VB
0
2.5
5
mA
VB capacitance
0.08
μF
RBLNK
0
350
k
Synchronization pulse width input (when used)
25
ns
Operating junction temperature range, TJ
–40
125
°C
(1)
ARTN and COM tied to RTN.
(2)
This is the minimum current limit value. Viable systems are designed for maximum currents less than this value with reasonable margin.
IEEE 802.3at permits 600-mA continuous loading.
6.4 Thermal Information
TPS23754,
TPS23754-1,
TPS23756
THERMAL METRIC(1)
UNIT
PWP (HTSSOP)
20 PINS
RθJA
Junction-to-ambient thermal resistance
44.4
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
23.4
°C/W
RθJB
Junction-to-board thermal resistance
20.1
°C/W
ψJT
Junction-to-top characterization parameter(2)
0.7
°C/W
ψJB
Junction-to-board characterization parameter
19.9
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2)
Thermal resistance junction to case top for devices mounted per SLMA002. TJ = TTOP + (ΨJT × PJ). Use ΨJT to validate TJ from
measurements.
Copyright © 2008–2015, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Links: TPS23754 TPS23754-1 TPS23756


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