Chip Resistor Surface Mount

www.yageo.com

Jan 14, 2009 V.1

Product specification

4

8

SERIES

TR

0402/0603/0805/1206 (RoHS Compliant)

Table 1 For outlines see fig. 2

TYPE

L (mm) W (mm)

H (mm)

MARKING

TR0402/0603/0805/1206

No marking

For further marking information, please see special data sheet “Chip resistors marking”.

Fig. 1

ynsc007

CONSTRUCTION

The resistors are constructed on a high-grade ceramic

body (aluminium oxide). Internal metal electrodes are

added at each end and a connection is made between

them using a resistive metal glaze; the approximate

resistor values are dependent on the composition of

the glaze.

The resistive layer is covered with a translucent

protective coat. Finally, two end electrodes are added,

the composition of which has been designed to provide

ease of soldering. See fig. 2.

DIMENSIONS

overcoat

protective glass

resistive layer

(Jumper chip is a conductor)

inner electrode

termination(Ni/matte tin)

ceramic substrate

H

I2

YNSC056

overcoat

W

L

inner electrode

Fig. 2 Chip resistor outlines

O

S

For dimension see Table 1

CHARACTERISTICS

TYPE

RESISTANCE

RANGE

Rated

Power

Operating

Temperature

Range

Max.

Working

Voltage

Max.

Overload

Voltage

Dielectric

Withstanding

Voltage

Temperature Coefficient

of Resistance

TR0402

1/16 W

50 V

100 V

100 V

TR0603

1/16 W

–55 °C to

+125 °C

50 V

100 V

100 V

TR0805

1/8 W

150 V

300 V

500 V

TR1206

0/-10%, 0/-20%, 0/-30%:

1 Ω to 10 MΩ

(E-24)

1/4 W

–55 °C to

+155 °C

200 V

500 V

500 V

1 Ω ≤ R ≤ 10 Ω: ±200 ppm/°C

10 Ω < R ≤ 1 MΩ: ±100 ppm/°C

1 MΩ < R ≤ 10 MΩ: ±200 ppm/°C

ELECTRICAL CHARACTERISTICS

Table 2