NTA4153N, NTE4153N, NVA4153N, NVE4153N

http://onsemi.com

6

PACKAGE DIMENSIONS

SC−89

CASE 463C−03

ISSUE C

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD

FINISH THICKNESS. MINIMUM LEAD THICKNESS

IS THE MINIMUM THICKNESS OF BASE

MATERIAL.

4. 463C−01 OBSOLETE, NEW STANDARD 463C−02.

DIM

A

MIN

NOM

MIN

NOM

INCHES

1.50

1.60

1.70

0.059

MILLIMETERS

B

0.75

0.85

0.95

0.030

C

0.60

0.70

0.80

0.024

D

0.23

0.28

0.33

0.009

G

0.50 BSC

H

0.53 REF

J

0.10

0.15

0.20

0.004

K

0.30

0.40

0.50

0.012

L

1.10 REF

M

−−−

−−−

10

−−−

N

−−−

−−−

10

−−−

S

1.50

1.60

1.70

0.059

0.063

0.067

0.034

0.040

0.028

0.031

0.011

0.013

0.020 BSC

0.021 REF

0.006

0.008

0.016

0.020

0.043 REF

−−−

10

−−−

10

0.063

0.067

MAX

MAX

_

_

_

_

G

M

0.08 (0.003)

X

J

−X−

−Y−

A

B

Y

12

3

N

2 PL

K

C

−T−

SEATING

PLANE

M

S

1.10

0.043

0.53

0.020

1.00

0.039

mm

inches

SCALE 10:1

0.53

0.020

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

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