NDF11N50Z

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5

TYPICAL CHARACTERISTICS

Figure 12. Maximum Rated Forward Biased

Safe Operating Area NDF11N50Z

SINGLE PULSE

10

ms

100

ms

10 ms

dc

1 ms

THERMAL LIMIT

PACKAGE LIMIT

PULSE TIME (s)

DUTY CYCLE = 0.5

SINGLE PULSE

Figure 13. Thermal Impedance (Junction−to−Case) for NDF11N50Z

Steady State

0.2

0.1

0.05

0.02

0.01

1E−06

1E−05

1E−04

1E−03

1E−02

1E−01

1E+00

1E+01

1E+02

1E+03

0.01

0.1

1

10

100

0.1

1

10

100

1000

0.001

0.01

0.1

1

10

LEADS

HEATSINK

0.110

″ MIN

Figure 14. Isolation Test Diagram

Measurement made between leads and heatsink with all leads shorted together.

*For additional mounting information, please download the ON Semiconductor

Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.