L9659 datasheet(9/51 Pages) STMICROELECTRONICS

Part #	L9659

Description	Octal squib driver ASIC for safety application

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Manufacturer	STMICROELECTRONICS [STMicroelectronics]

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L9659

Electrical specifications

Doc ID 022048 Rev 2

9/51

2

Electrical specifications

2.1

Absolute maximum ratings

The following maximum ratings are continuous absolute ratings; exceeding any one of these

values may cause permanent damage to the integrated circuit.

Table 3.

Absolute maximum ratings

Symbol

Parameter

Value

Unit

VDD

(1)

Supply voltage

- 0.3 to 5.5

V

VSDIAG

Supply voltage for squib diagnostics

- 0.3 to 40

V

VRESx

VRES voltage (VRES0, VRES1, VRES2, VRES3, VRES4,

VRES5, VRES6, VRES7)

- 0.3 to 40

V

SQHx

Squib high side drivers (SQH0, SQH1, SQH2, SQH3, SQH4,

SQH5, SQH6, SQH7)

- 0.6 to 40

V

SQLx

Squib low side drivers (SQL0, SQL1, SQL2, SQL3, SQL4,

SQL5, SQL6, SQL7)

- 0.3 to 40

V

TEST

Test pin

-0.3 to 40

V

VI

Discrete input voltage (RESETB, CS_D, SCLK, MOSI,

FEN1, FEN2, FEN3, FEN4, IREF)

- 0.3 to 5.5

V

VO

Discrete output voltage (MISO, AOUT)

- 0.3 to 5.5

V

AGND

Analog output reference

-0.3 to 5.5

V

GNDx

Ground (GND0, GND1, GND2, GND3, GND4, GND5,

GND6, GND7)

-0.3 to 5.5

V

Tj

(2)

Maximum steady-state junction temperature

150

°C

Tamb

Ambient temperature

-40 to 95

°C

Tstg

Storage temperature

-65 to 150

°C

Rth j amb

Thermal resistance junction to ambient (on FR-4 board)

46

°C/W

The following maximum ratings are up to 48 hours; exceeding any one of these values for longer than a total time of

48 hours may cause permanent damage to the integrated circuit.

VDD

Supply voltage

- 0.3 to 6.0

V

VI

Discrete input voltage (RESETB, CS_D, SCLK, MOSI,

FEN1, FEN2, FEN3, FEN4, IREF)

- 0.3 to 6.0

V

VO

Discrete output voltage (MISO, AOUT)

- 0.3 to 6.0

V

AGND

Analog output reference

-0.3 to 6.0

V

GNDx

Ground (GND0, GND1, GND2, GND3, GND4, GND5,

GND6, GND7)

-0.3 to 6.0

V

Tj

(2)

Maximum steady-state junction temperature

150

°C

Tamb

Ambient temperature

-40 to 95

°C

Tstg

Storage temperature

-65 to 150

°C

Rth j amb

Thermal resistance junction to ambient (on FR-4 board)

46

°C/W

1.

Exceeding a VDD of 5.1V during a deployment may cause damage

2.

To allow for deployment the maximum steady state junction temperature cannot exceed 130°C. Under the operating ratings

defined in section 2.3 the steady state junction temperature will not exceed 130°C.

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