TLV320AIC3254

SLAS549D – SEPTEMBER 2008 – REVISED NOVEMBER 2014

www.ti.com

Table of Contents

8.17

1

Features .................................................................. 1

8.18

SPI Interface Timing (See Figure 7) ..................... 21

2

Applications ........................................................... 1

8.19

Typical Characteristics .......................................... 22

3

Description ............................................................. 1

8.20

Typical Characteristics, FFT ................................. 24

4

Simplified Block Diagram ..................................... 1

9

Parameter Measurement Information ................ 25

5

Revision History..................................................... 2

10

Detailed Description ........................................... 25

6

Device Comparison Table..................................... 3

10.1

Overview ............................................................... 25

7

Pin Configuration and Functions ......................... 4

10.2

Functional Block Diagram ..................................... 26

8

Specifications......................................................... 7

10.3

Feature Description............................................... 26

8.1

Absolute Maximum Ratings ...................................... 7

10.4

Device Functional Modes...................................... 34

8.2

Handling Ratings ...................................................... 7

10.5

Software ................................................................ 34

8.3

Recommended Operating Conditions ....................... 7

10.6

Register Map......................................................... 34

8.4

Thermal Information .................................................. 8

11

Applications and Implementation...................... 39

8.5

Electrical Characteristics, ADC ................................. 8

11.1

Application Information.......................................... 39

8.6

Electrical Characteristics, Bypass Outputs ............. 10

11.2

Typical Application ................................................ 39

8.7

Electrical Characteristics, Microphone Interface..... 11

12

Power Supply Recommendations ..................... 43

8.8

Electrical Characteristics, Audio DAC Outputs ....... 12

13

Layout................................................................... 43

8.9

Electrical Characteristics, LDO ............................... 14

13.1

Layout Guidelines ................................................. 43

8.10

Electrical Characteristics, Misc. ............................ 15

13.2

Layout Example .................................................... 44

8.11

Electrical Characteristics, Logic Levels................. 16

14

Device and Documentation Support ................. 45

8.12

Figure 1)................................................................... 16

14.1

Documentation Support ........................................ 45

8.13

14.2

Trademarks ........................................................... 45

Figure 2)................................................................... 17

14.3

Electrostatic Discharge Caution ............................ 45

8.14

DSP Timing in Master Mode (see Figure 3) ......... 18

14.4

Glossary ................................................................ 45

8.15

DSP Timing in Slave Mode (see Figure 4) ........... 19

15

Mechanical, Packaging, and Orderable

8.16

Digital Microphone PDM Timing (see Figure 5).... 19

Information ........................................................... 45

5 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (December 2013) to Revision D

Page

•

Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device

Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout

section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information

section ................................................................................................................................................................................... 1

•

Added "Audio input max ac signal swing" to the Recommended Operating Conditions table............................................... 7

•

Changes from Revision B (August 2012) to Revision C

Page

•

Deleted "Acoustic Echo Cancellation (AEC)" and "Active Noise Cancellation (ANC)" from applications list......................... 1

•

Changed the pin description From: connect to DVss. To: D-LDO enable signal ................................................................... 6

•

Added "DVDD" to LDOs disabled in operating conditions statement..................................................................................... 7

•

2

Submit Documentation Feedback

Copyright © 2008–2014, Texas Instruments Incorporated

Product Folder Links: TLV320AIC3254