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TLV320A3254IRHBRG4 Datasheet(PDF) 2 Page - Texas Instruments |
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TLV320A3254IRHBRG4 Datasheet(HTML) 2 Page - Texas Instruments |
2 / 53 page TLV320AIC3254 SLAS549D – SEPTEMBER 2008 – REVISED NOVEMBER 2014 www.ti.com Table of Contents 8.17 I2C Interface Timing .............................................. 20 1 Features .................................................................. 1 8.18 SPI Interface Timing (See Figure 7) ..................... 21 2 Applications ........................................................... 1 8.19 Typical Characteristics .......................................... 22 3 Description ............................................................. 1 8.20 Typical Characteristics, FFT ................................. 24 4 Simplified Block Diagram ..................................... 1 9 Parameter Measurement Information ................ 25 5 Revision History..................................................... 2 10 Detailed Description ........................................... 25 6 Device Comparison Table..................................... 3 10.1 Overview ............................................................... 25 7 Pin Configuration and Functions ......................... 4 10.2 Functional Block Diagram ..................................... 26 8 Specifications......................................................... 7 10.3 Feature Description............................................... 26 8.1 Absolute Maximum Ratings ...................................... 7 10.4 Device Functional Modes...................................... 34 8.2 Handling Ratings ...................................................... 7 10.5 Software ................................................................ 34 8.3 Recommended Operating Conditions ....................... 7 10.6 Register Map......................................................... 34 8.4 Thermal Information .................................................. 8 11 Applications and Implementation...................... 39 8.5 Electrical Characteristics, ADC ................................. 8 11.1 Application Information.......................................... 39 8.6 Electrical Characteristics, Bypass Outputs ............. 10 11.2 Typical Application ................................................ 39 8.7 Electrical Characteristics, Microphone Interface..... 11 12 Power Supply Recommendations ..................... 43 8.8 Electrical Characteristics, Audio DAC Outputs ....... 12 13 Layout................................................................... 43 8.9 Electrical Characteristics, LDO ............................... 14 13.1 Layout Guidelines ................................................. 43 8.10 Electrical Characteristics, Misc. ............................ 15 13.2 Layout Example .................................................... 44 8.11 Electrical Characteristics, Logic Levels................. 16 14 Device and Documentation Support ................. 45 8.12 I2S LJF and RJF Timing in Master Mode (see Figure 1)................................................................... 16 14.1 Documentation Support ........................................ 45 8.13 I2S LJF and RJF Timing in Slave Mode (see 14.2 Trademarks ........................................................... 45 Figure 2)................................................................... 17 14.3 Electrostatic Discharge Caution ............................ 45 8.14 DSP Timing in Master Mode (see Figure 3) ......... 18 14.4 Glossary ................................................................ 45 8.15 DSP Timing in Slave Mode (see Figure 4) ........... 19 15 Mechanical, Packaging, and Orderable 8.16 Digital Microphone PDM Timing (see Figure 5).... 19 Information ........................................................... 45 5 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision C (December 2013) to Revision D Page • Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ................................................................................................................................................................................... 1 • Added "Audio input max ac signal swing" to the Recommended Operating Conditions table............................................... 7 • Added the Digital Microphone PDM Timing (see Figure 5) section ..................................................................................... 19 Changes from Revision B (August 2012) to Revision C Page • Deleted "Acoustic Echo Cancellation (AEC)" and "Active Noise Cancellation (ANC)" from applications list......................... 1 • Changed the pin description From: connect to DVss. To: D-LDO enable signal ................................................................... 6 • Added "DVDD" to LDOs disabled in operating conditions statement..................................................................................... 7 • Corrected thi to th(DIN)............................................................................................................................................................. 21 2 Submit Documentation Feedback Copyright © 2008–2014, Texas Instruments Incorporated Product Folder Links: TLV320AIC3254 |
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