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W29GL128CL9B Datasheet(PDF) 4 Page - Winbond

Part # W29GL128CL9B
Description  128M-BIT 3.0-VOLT PARALLEL FLASH MEMORY WITH PAGE MODE
Download  67 Pages
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Manufacturer  WINBOND [Winbond]
Direct Link  http://www.winbond.com
Logo WINBOND - Winbond

W29GL128CL9B Datasheet(HTML) 4 Page - Winbond

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W29GL128C
ii
8.1
Absolute Maximum Stress Ratings ............................................................................... 29
8.2
Operating Temperature and Voltage ............................................................................ 29
8.3
DC Characteristics ........................................................................................................ 30
8.4
Switching Test Circuits.................................................................................................. 31
8.4.1
Switching Test Waveform ............................................................................................... 31
8.5
AC Characteristics ........................................................................................................ 32
8.5.1
Instruction Write Operation ............................................................................................. 33
8.5.2
Read / Reset Operation .................................................................................................. 34
8.5.3
Erase/Program Operation ............................................................................................... 36
8.5.4
Write Operation Status.................................................................................................... 46
8.5.5
WORD/BYTE CONFIGURATION (#BYTE)..................................................................... 50
8.5.6
DEEP POWER DOWN MODE........................................................................................ 52
8.5.7
WRITE BUFFER PROGRAM.......................................................................................... 52
8.6
Recommended Operating Conditions........................................................................... 53
8.6.1
At Device Power-up ........................................................................................................ 53
8.7
Erase and Programming Performance ......................................................................... 54
8.8
Data Retention .............................................................................................................. 54
8.9
Latch-up Characteristics ............................................................................................... 54
8.10
Pin Capacitance............................................................................................................ 54
9
PACKAGE DIMENSIONS ......................................................................................................... 55
9.1
TSOP 56-pin 14x20mm ................................................................................................ 55
9.2
Thin & Fine-Pitch Ball Grid Array, 56 ball, 7x9mm (TFBGA56) .................................... 56
9.3
Low-Profile Fine-Pitch Ball Grid Array, 64-ball 11x13mm (LFBA64) ............................ 57
10
ORDERING INFORMATION..................................................................................................... 58
10.1
Ordering Part Number Definitions................................................................................. 58
10.2
Valid Part Numbers and Top Side Marking .................................................................. 59
11
HISTORY .................................................................................................................................. 60


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