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W25Q32FWBYIG Datasheet(PDF) 2 Page - Winbond |
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W25Q32FWBYIG Datasheet(HTML) 2 Page - Winbond |
2 / 94 page W25Q32FW - 1 - Table of Contents 1. GENERAL DESCRIPTIONS............................................................................................................. 4 2. FEATURES....................................................................................................................................... 4 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 5 3.1 Pin Configuration SOIC / VSOP 208-mil .............................................................................. 5 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm, XSON 4x4-mm ............................................ 5 3.3 Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6-mm, XSON 4x4-mm............ 5 3.4 Pin Configuration SOIC 300-mil ........................................................................................... 6 3.5 Pin Description SOIC 300-mil............................................................................................... 6 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 7 3.7 Ball Description TFBGA 8x6-mm ......................................................................................... 7 3.8 Ball Configuration WLCSP ................................................................................................... 8 3.9 Ball Description WLCSP12................................................................................................... 8 4. PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Chip Select (/CS) .................................................................................................................. 9 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .................................... 9 4.3 Write Protect (/WP)............................................................................................................... 9 4.4 HOLD (/HOLD) ..................................................................................................................... 9 4.5 Serial Clock (CLK) ................................................................................................................ 9 4.6 Reset (/RESET).................................................................................................................... 9 5. BLOCK DIAGRAM .......................................................................................................................... 10 6. FUNCTIONAL DESCRIPTIONS..................................................................................................... 11 6.1 SPI / QPI Operations .......................................................................................................... 11 6.1.1 Standard SPI Instructions .....................................................................................................11 6.1.2 Dual SPI Instructions ............................................................................................................11 6.1.3 Quad SPI Instructions ...........................................................................................................12 6.1.4 QPI Instructions ....................................................................................................................12 6.1.5 Hold Function........................................................................................................................12 6.1.6 Software Reset & Hardware /RESET pin..............................................................................13 6.2 Write Protection .................................................................................................................. 14 7. STATUS AND CONFIGURATION REGISTERS ............................................................................ 15 7.1 Status Registers ................................................................................................................. 15 7.1.1 Erase/Write In Progress (BUSY) – Status Only .................................................................15 7.1.2 Write Enable Latch (WEL) – Status Only...........................................................................15 7.1.3 Block Protect Bits (BP2, BP1, BP0) – Volatile/Non-Volatile Writable.................................15 7.1.4 Top/Bottom Block Protect (TB) – Volatile/Non-Volatile Writable ........................................16 7.1.5 Sector/Block Protect Bit (SEC) – Volatile/Non-Volatile Writable ........................................16 7.1.6 Complement Protect (CMP) – Volatile/Non-Volatile Writable ............................................16 7.1.7 Status Register Protect (SRP1, SRP0) – Volatile/Non-Volatile Writable............................16 7.1.8 Erase/Program Suspend Status (SUS) – Status Only .......................................................17 7.1.9 Security Register Lock Bits (LB[3:1]) – Volatile/Non-Volatile OTP Writable.......................17 |
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