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W25Q128FVTIG Datasheet(PDF) 2 Page - Winbond |
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W25Q128FVTIG Datasheet(HTML) 2 Page - Winbond |
2 / 100 page W25Q128FV - 1 - Table of Contents 1. GENERAL DESCRIPTIONS ..................................................................................................................... 5 2. FEATURES ............................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS................................................................................... 6 3.1 Pin Configuration SOIC / VSOP 208-mil .......................................................................................... 6 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm................................................................................... 6 3.3 Pin Description SOIC / VSOP 208-mil, WSON 6x5-mm / 8x6-mm .................................................. 6 3.4 Pin Configuration SOIC 300-mil ....................................................................................................... 7 3.5 Pin Description SOIC 300-mil ........................................................................................................... 7 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ............................................................. 8 3.7 Ball Description TFBGA 8x6-mm...................................................................................................... 8 3.8 Pin Configuration PDIP 300-mil ........................................................................................................ 9 3.9 Pin Description PDIP 300-mil ........................................................................................................... 9 4. PIN DESCRIPTIONS............................................................................................................................... 10 4.1 Chip Select (/CS) ............................................................................................................................ 10 4.2 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3) .............................................. 10 4.3 Write Protect (/WP) ......................................................................................................................... 10 4.4 HOLD (/HOLD) ............................................................................................................................... 10 4.5 Serial Clock (CLK) .......................................................................................................................... 10 4.6 Reset (/RESET) .............................................................................................................................. 10 5. BLOCK DIAGRAM................................................................................................................................... 11 6. FUNCTIONAL DESCRIPTIONS ............................................................................................................. 12 6.1 SPI / QPI Operations ...................................................................................................................... 12 6.1.1 Standard SPI Instructions ...............................................................................................................................12 6.1.2 Dual SPI Instructions ......................................................................................................................................12 6.1.3 Quad SPI Instructions.....................................................................................................................................13 6.1.4 QPI Instructions ..............................................................................................................................................13 6.1.5 Hold Function .................................................................................................................................................13 6.1.6 Software Reset & Hardware /RESET pin........................................................................................................15 6.2 Write Protection .............................................................................................................................. 16 6.2.1 Write Protect Features....................................................................................................................................16 7. STATUS AND CONFIGURATION REGISTERS .................................................................................... 17 7.1 Status Registers ............................................................................................................................. 17 7.1.1 Erase/Write In Progress (BUSY) – Status Only ..............................................................................................17 7.1.2 Write Enable Latch (WEL) – Status Only........................................................................................................17 7.1.3 Block Protect Bits (BP2, BP1, BP0) – Volatile/Non-Volatile Writable..............................................................17 |
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