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W25Q16DWSSIP Datasheet(PDF) 7 Page - Winbond |
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W25Q16DWSSIP Datasheet(HTML) 7 Page - Winbond |
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7 / 84 page  W25Q16DW Publication Release Date: September 1, 2014 - 7 - Revision J 3.4 Ball Configuration WLCSP D1 GND D2 DI(IO0) A1 /CS A2 VCC B1 DO(IO1) B2 /HOLD(IO3) C1 /WP(IO2) C2 CLK Top View D1 GND D2 DI(IO0) A1 /CS A2 VCC B1 DO(IO1) B2 /HOLD(IO3) C1 /WP(IO2) C2 CLK Bottom View Figure 1c. W25Q16DW Ball Assignments, 8-ball WLCSP (Package Code BY) 3.5 Ball Description WLCSP BALL NO. PIN NAME I/O FUNCTION A1 VCC Power Supply A2 /CS I Chip Select Input B1 /HOLD (IO3) I/O Hold Input (Data Input Output 3)*2 B2 DO (IO1) I/O Data Output (Data Input Output 1)*1 C1 CLK I Serial Clock Input C2 /WP (IO2) I/O Write Protect Input (Data Input Output 2)*2 D1 DI (IO0) I/O Data Input (Data Input Output 0)*1 D2 GND Ground *1 IO0 and IO1 are used for Standard and Dual SPI instructions *2 IO0 – IO3 are used for Quad SPI instructions |
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