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25M02GVTCIT Datasheet(PDF) 2 Page - Winbond |
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25M02GVTCIT Datasheet(HTML) 2 Page - Winbond |
2 / 68 page W25M02GV - 1 - Table of Contents 1. GENERAL DESCRIPTIONS............................................................................................................. 6 2. FEATURES ....................................................................................................................................... 6 3. PACKAGE TYPES AND PIN CONFIGURATIONS........................................................................... 7 3.1 Pad Configuration WSON 8x6-mm ...................................................................................... 7 3.2 Pad Description WSON 8x6-mm.......................................................................................... 7 3.3 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) ................................................. 8 3.4 Ball Description TFBGA 8x6-mm ......................................................................................... 8 4. PIN DESCRIPTIONS ........................................................................................................................ 9 4.1 Serial MCP (SpiStack®) Device Configuration...................................................................... 9 4.2 Chip Select (/CS) .................................................................................................................. 9 4.3 Serial Data Input, Output and IOs (DI, DO and IO0, IO1, IO2, IO3)..................................... 9 4.4 Write Protect (/WP) ............................................................................................................ 10 4.5 HOLD (/HOLD) ................................................................................................................... 10 4.6 Serial Clock (CLK) .............................................................................................................. 10 5. SINGLE DIE (W25N01GV) BLOCK DIAGRAM .............................................................................. 11 6. FUNCTIONAL DESCRIPTIONS ..................................................................................................... 12 6.1 Device Operation Flow ....................................................................................................... 12 6.1.1 Stacked Die Operations........................................................................................................12 6.1.2 Standard SPI Instructions.....................................................................................................12 6.1.3 Dual SPI Instructions ............................................................................................................13 6.1.4 Quad SPI Instructions...........................................................................................................13 6.1.5 Hold Function .......................................................................................................................13 6.2 Write Protection .................................................................................................................. 14 7. PROTECTION, CONFIGURATION AND STATUS REGISTERS .................................................. 15 7.1 Protection Register / Status Register-1 (Volatile Writable, OTP lockable) ......................... 15 7.1.1 Block Protect Bits (BP3, BP2, BP1, BP0, TB) – Volatile Writable, OTP lockable.................15 7.1.2 Write Protection Enable Bit (WP-E) – Volatile Writable, OTP lockable................................16 7.1.3 Status Register Protect Bits (SRP1, SRP0) – Volatile Writable, OTP lockable ....................16 7.2 Configuration Register / Status Register-2 (Volatile Writable) ........................................... 17 7.2.1 One Time Program Lock Bit (OTP-L) – OTP lockable..........................................................17 7.2.2 Enter OTP Access Mode Bit (OTP-E) – Volatile Writable.....................................................17 7.2.3 Status Register-1 Lock Bit (SR1-L) – OTP lockable.............................................................17 7.2.4 ECC Enable Bit (ECC-E) – Volatile Writable ........................................................................18 7.2.5 Buffer Read / Continuous Read Mode Bit (BUF) – Volatile Writable ....................................18 7.3 Status Register-3 (Status Only) .......................................................................................... 19 7.3.1 Look-Up Table Full (LUT-F) – Status Only ...........................................................................19 |
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